title: A Lateral Differential Resonant Pressure Microsensor Based on SOI-Glass Wafer-Level Vacuum Packaging.
abstract: This paper presents the fabrication and characterization of a resonant pressure microsensor based on SOI-glass wafer-level vacuum packaging. The SOI-based pressure microsensor consists of a pressure-sensitive diaphragm at the handle layer and two lateral resonators (electrostatic excitation and capacitive detection) on the device layer as a differential setup. The resonators were vacuum packaged with a glass cap using anodic bonding and the wire interconnection was realized using a mask-free electrochemical etching approach by selectively patterning an Au film on highly topographic surfaces. The fabricated resonant pressure microsensor with dual resonators was characterized in a systematic manner, producing a quality factor higher than 10,000 (~6 months), a sensitivity of about 166 Hz/kPa and a reduced nonlinear error of 0.033% F.S. Based on the differential output, the sensitivity was increased to two times and the temperature-caused frequency drift was decreased to 25%.
authors.affiliation: State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China. xiebo11@mails.ucas.ac.cn.|University of Chinese Academy of Sciences, Beijing 100190, China. xiebo11@mails.ucas.ac.cn.
authors.forename: Bo
authors.initials: B
authors.lastname: Xie
authors.affiliation: State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China. xingyonghao13@mails.ucas.ac.cn.|University of Chinese Academy of Sciences, Beijing 100190, China. xingyonghao13@mails.ucas.ac.cn.
authors.forename: Yonghao
authors.initials: Y
authors.lastname: Xing
authors.affiliation: State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China. wangeomshuang13@mails.ucas.ac.cn.|University of Chinese Academy of Sciences, Beijing 100190, China. wangeomshuang13@mails.ucas.ac.cn.
authors.forename: Yanshuang
authors.initials: Y
authors.lastname: Wang
authors.affiliation: State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China. chenjian@mail.ie.ac.cn.
authors.forename: Jian
authors.initials: J
authors.lastname: Chen
authors.affiliation: State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China. dychen@mail.ie.ac.cn.
authors.forename: Deyong
authors.initials: D
authors.lastname: Chen
authors.affiliation: State Key Laboratory of Transducer Technology, Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China. jbwang@mail.ie.ac.cn.
authors.forename: Junbo
authors.initials: J
authors.lastname: Wang
mesh_terms: D055664:Electrochemical Techniques; D004566:Electrodes; D004867:Equipment Design; D005898:Glass / Q000737:chemistry*; D008670:Metals / Q000737:chemistry; D055616:Microtechnology / Q000295:instrumentation*; D011312:Pressure; D012825:Silicon / Q000737:chemistry*; D013696:Temperature; D014618:Vacuum
chemical_list: D008670:Metals; D012825:Silicon
keywords: anodic bonding; differential frequency output; mask-free metallization; resonant pressure sensor; vacuum packaging; wire interconnection