title: Hybrid Surface Acoustic Wave-Electrohydrodynamic Atomization (SAW-EHDA) For the Development of Functional Thin Films.
abstract: Conventional surface acoustic wave - electrostatic deposition (SAW-ED) technology is struggling to compete with other thin film fabrication technologies because of its limitation in atomizing high density solutions or solutions with strong inter-particle bonding that requires very high frequency (100 MHz) and power. In this study, a hybrid surface acoustic wave - electrohydrodynamic atomization (SAW-EHDA) system has been introduced to overcome this problem by integrating EHDA with SAW to achieve the deposition of different types of conductive inks at lower frequency (19.8 MHZ) and power. Three materials, Poly [2-methoxy-5-(2-ethylhexyloxy)-1, 4-phenylenevinylene] (MEH-PPV), Zinc Oxide (ZnO), and Poly(3, 4-ethylenedioxythiophene):Polystyrene Sulfonate (
  PSS) have been successfully deposited as thin films through the hybrid SAW-EHDA. The films showed good morphological, chemical, electrical, and optical characteristics. To further evaluate the characteristics of deposited films, a humidity sensor was fabricated with active layer of
  PSS deposited using the SAW-EHDA system. The response of sensor was outstanding and much better when compared to similar sensors fabricated using other manufacturing techniques. The results of the device and the films' characteristics suggest that the hybrid SAW-EHDA technology has high potential to efficiently produce wide variety of thin films and thus predict its promising future in certain areas of printed electronics.
authors.affiliation: Department of Mechatronics Engineering, Jeju National University, Jeju 690-756, South Korea.
authors.forename: Kyung Hyun
authors.initials: KH
authors.lastname: Choi
authors.affiliation: Department of Mechatronics Engineering, Jeju National University, Jeju 690-756, South Korea.
authors.forename: Hyun Bum
authors.initials: HB
authors.lastname: Kim
authors.affiliation: Department of Mechatronics Engineering, Jeju National University, Jeju 690-756, South Korea.
authors.forename: Kamran
authors.initials: K
authors.lastname: Ali
authors.affiliation: Department of Mechatronics Engineering, Jeju National University, Jeju 690-756, South Korea.
authors.forename: Memoon
authors.initials: M
authors.lastname: Sajid
authors.affiliation: Department of Mechatronics Engineering, Jeju National University, Jeju 690-756, South Korea.
authors.forename: Ghayas
authors.initials: G
authors.lastname: Uddin Siddiqui
authors.affiliation: Department of Applied Mathematics University of Waterloo, Canada.
authors.forename: Dong Eui
authors.initials: DE
authors.lastname: Chang
authors.affiliation: Korea Institute of Industrial Technology, South Korea.
authors.forename: Hyung Chan
authors.initials: HC
authors.lastname: Kim
authors.affiliation: Department of Electronics Engineering, Jeju National University, Jeju 690-756, South Korea.
authors.forename: Jeong Beom
authors.initials: JB
authors.lastname: Ko
authors.affiliation: Department of Electronics Engineering, Jeju National University, Jeju 690-756, South Korea.
authors.forename: Hyun Woo
authors.initials: HW
authors.lastname: Dang
authors.affiliation: Department of Electronics Engineering, Jeju National University, Jeju 690-756, South Korea.
authors.forename: Yang Hoi
authors.initials: YH
authors.lastname: Doh