title: 3D Graphene-Infused Polyimide with Enhanced Electrothermal Performance for Long-Term Flexible Space Applications.
abstract: Polyimides (PIs) have been praised for their high thermal stability, high modulus of elasticity and tensile strength, ease of fabrication, and moldability. They are currently the standard choice for both substrates for flexible electronics and space shielding, as they render high temperature and UV stability and toughness. However, their poor thermal conductivity and completely electrically insulating characteristics have caused other limitations, such as thermal management challenges for flexible high-power electronics and spacecraft electrostatic charging. In order to target these issues, a hybrid of PI with 3D-graphene (3D-C), 3D-C/PI, is developed here. This composite renders extraordinary enhancements of thermal conductivity (one order of magnitude) and electrical conductivity (10 orders of magnitude). It withstands and keeps a stable performance throughout various bending and thermal cycles, as well as the oxidative and aggressive environment of ground-based, simulated space environments. This makes this new hybrid film a suitable material for flexible space applications.
authors.affiliation: School of Electrical and Electronic Engineering, Nanyang Technological University, Block S1, 50 Nanyang Avenue, 639798, Singapore.|CNRS International NTU Thales Research Alliance (CINTRA), 50 Nanyang Avenue, 639798, Singapore.
authors.forename: Manuela
authors.initials: M
authors.lastname: Loeblein
authors.affiliation: Space Environment Section, Soreq NRC, Yavne, 81800, Israel.
authors.forename: Asaf
authors.initials: A
authors.lastname: Bolker
authors.affiliation: Temasek Laboratories@NTU, 50 Nanyang Avenue, 639798, Singapore.
authors.forename: Siu Hon
authors.initials: SH
authors.lastname: Tsang
authors.affiliation: Space Environment Section, Soreq NRC, Yavne, 81800, Israel.
authors.forename: Nurit
authors.initials: N
authors.lastname: Atar
authors.affiliation: Solid State Institute, Technion - Israel Institute of Technology, Technion City, Haifa, 3200003, Israel.
authors.forename: Cecile
authors.initials: C
authors.lastname: Uzan-Saguy
authors.affiliation: Space Environment Section, Soreq NRC, Yavne, 81800, Israel.
authors.forename: Ronen
authors.initials: R
authors.lastname: Verker
authors.affiliation: Space Environment Section, Soreq NRC, Yavne, 81800, Israel.
authors.forename: Irina
authors.initials: I
authors.lastname: Gouzman
authors.affiliation: Space Environment Section, Soreq NRC, Yavne, 81800, Israel.
authors.forename: Eitan
authors.initials: E
authors.lastname: Grossman
authors.affiliation: School of Electrical and Electronic Engineering, Nanyang Technological University, Block S1, 50 Nanyang Avenue, 639798, Singapore.
authors.forename: Edwin Hang Tong
authors.initials: EH
authors.lastname: Teo
keywords: 3D graphene; ageing; flexible electronics; polyimide; space environment simulation