title: Wafer Resection of the Distal Ulna.
abstract: The wafer procedure is an effective treatment for ulnar impaction syndrome, which decompresses the ulnocarpal junction through a limited open or arthroscopic approach. In comparison with other common decompressive procedures, the wafer procedure does not require bone healing or internal fixation and also provides excellent exposure of the proximal surface of the triangular fibrocartilage complex. Results of the wafer procedure have been good and few complications have been reported.
authors.affiliation: Orthopedic Associates of Lancaster, Lancaster, PA.
authors.forename: Adam
authors.initials: A
authors.lastname: Griska
authors.affiliation: Hand Surgery Associates, New England Baptist Hospital, Boston, MA. Electronic address: pfeldon@aol.com.
authors.forename: Paul
authors.initials: P
authors.lastname: Feldon
mesh_terms: D001182:Arthroscopy / Q000379:methods*; D019299:Decompression, Surgical; D006801:Humans; D007592:Joint Diseases / Q000601:surgery*; D010027:Osteotomy; D013577:Syndrome; D051478:Triangular Fibrocartilage / Q000293:injuries / Q000601:surgery*; D014457:Ulna / Q000601:surgery*; D014955:Wrist Joint / Q000601:surgery*
keywords: Wafer; distal ulna; ulnar impaction; ulnar shortening