title: Durability of solvent-free one-step self-etch adhesive under simulated intrapulpal pressure.
abstract: BACKGROUND
  There are different solvents presented in simplified adhesives. Bond-1 SF has been developed, which contains neither water nor organic solvents, in order to eliminate technical issues in terms of evaporation of solvents and concerns for the durability of resin-dentin bond. Thus this study was conducted to evaluate the microtensile bond strength (?TBS) of solvent-free and ethanol-based one-step self-etch adhesives to dentin under simulated intrapulpal pressure (IPP).
  
  
  METHODS
  Occlusal surfaces of human molars were prepared to expose mid-dentin depth. Bond-1SF Solvent-Free SE [SF] and AdperTM easy one adhesives [AE] were applied on dentin specimens. Resin composite build up was done in increments. Then specimens were stored under simulated IPP 20 mmHg, immersed in artificial saliva at 37 ºC for 24 hours (24h) and 6 months (6m). Specimens were sectioned into sticks of (1 mm²) to be tested for (?TBS) using a universal testing machine. Both fractured sections of each stick were inspected using a stereomicroscope at 40× magnification to determine the mode of failure. Data were statistically analyzed by Two-way ANOVA of Variance.
  
  
  RESULTS
  There was no statistically significant difference between the mean ?TBS of both [SF] and [AE] adhesives at both aging periods, 24h and 6m (p< 0.1103) and (p< 0.7148) respectively. Only for [AE] there was statistical significance for aging periods (p< 0.0057*). The most represented modes of failure were adhesive failure at tooth side.
  
  
  CONCLUSIONS
  Under simulated IPP solvent-free adhesive [SF] had comparable performance as ethanol-based adhesive [AE] when bonded to dentin substrate.
  
  
  BACKGROUND
  Bond strength, dentin, simulated intrapulpal pressure, self-etch adhesives, solvents.
authors.affiliation: Restorative and Dental Materials Research department, National Research Centre, Giza. Egypt.
authors.forename: Shaymaa M
authors.initials: SM
authors.lastname: Nagi