title: High Fidelity Tape Transfer Printing Based On Chemically Induced Adhesive Strength Modulation.
abstract: Transfer printing, a two-step process (i.e. picking up and printing) for heterogeneous integration, has been widely exploited for the fabrication of functional electronics system. To ensure a reliable process, strong adhesion for picking up and weak or no adhesion for printing are required. However, it is challenging to meet the requirements of switchable stamp adhesion. Here we introduce a simple, high fidelity process, namely tape transfer printing (TTP), enabled by chemically induced dramatic modulation in tape adhesive strength. We describe the working mechanism of the adhesion modulation that governs this process and demonstrate the method by high fidelity tape transfer printing several types of materials and devices, including Si pellets arrays, photodetector arrays, and electromyography (EMG) sensors, from their preparation substrates to various alien substrates. High fidelity tape transfer printing of components onto curvilinear surfaces is also illustrated.
authors.affiliation: Materials Science and Engineering Program, University of Houston, Houston, TX, 77204 USA.
authors.forename: Kyoseung
authors.initials: K
authors.lastname: Sim
authors.affiliation: Department of Mechanical Engineering, University of Houston, Houston, TX, 77204 USA.
authors.forename: Song
authors.initials: S
authors.lastname: Chen
authors.affiliation: Institute of Solid Mechanics, Beihang University, Beijing, 100191, China.
authors.forename: Yuhang
authors.initials: Y
authors.lastname: Li
authors.affiliation: Department of Mechanical Engineering, University of Houston, Houston, TX, 77204 USA.
authors.forename: Mejdi
authors.initials: M
authors.lastname: Kammoun
authors.affiliation: Department of Biomedical Engineering, University of Houston, Houston, TX, 77204 USA.
authors.forename: Yun
authors.initials: Y
authors.lastname: Peng
authors.affiliation: MOE Key Laboratory for Nonequilibrium Synthesis and Modulation of Condensed Matter, School of Science, Xi'an Jiaotong University, Xi'an, Shaanxi, 710049, China.
authors.forename: Minwei
authors.initials: M
authors.lastname: Xu
authors.affiliation: Department of Mechanical Engineering, University of Houston, Houston, TX, 77204 USA.
authors.forename: Yang
authors.initials: Y
authors.lastname: Gao
authors.affiliation: Department of Engineering Mechanics and Soft Matter Research Center, Zhejiang University, Hangzhou, Zhejiang, 310027, China.
authors.forename: Jizhou
authors.initials: J
authors.lastname: Song
authors.affiliation: Department of Biomedical Engineering, University of Houston, Houston, TX, 77204 USA.
authors.forename: Yingchun
authors.initials: Y
authors.lastname: Zhang
authors.affiliation: Materials Science and Engineering Program, University of Houston, Houston, TX, 77204 USA.|Department of Mechanical Engineering, University of Houston, Houston, TX, 77204 USA.
authors.forename: Haleh
authors.initials: H
authors.lastname: Ardebili
authors.affiliation: Materials Science and Engineering Program, University of Houston, Houston, TX, 77204 USA.|Department of Mechanical Engineering, University of Houston, Houston, TX, 77204 USA.|Department of Electrical and Computer Engineering, University of Houston, Houston, TX, 77204 USA.
authors.forename: Cunjiang
authors.initials: C
authors.lastname: Yu