title: Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms.
abstract: This article presents the flip-chip bonding of vertical-cavity surface-emitting lasers (VCSELs) to silicon grating couplers (GCs) via SU8 prisms. The SU8 prisms are defined on top of the GCs using non-uniform laser ablation process. The prisms enable perfectly vertical coupling from the bonded VCSELs to the GCs. The VCSELs are flip-chip bonded on top of the silicon GCs employing the laser-induced forward transfer (LIFT)-assisted thermocompression technique. An excess loss of < 1 dB at 1.55 µm measured from the bonded assemblies is reported in this paper. The results of high speed transmission experiments performed on the bonded assemblies with clear eye openings up to 20 Gb/s are also presented.
authors.forename: K S
authors.initials: KS
authors.lastname: Kaur
authors.forename: A Z
authors.initials: AZ
authors.lastname: Subramanian
authors.forename: P
authors.initials: P
authors.lastname: Cardile
authors.forename: R
authors.initials: R
authors.lastname: Verplancke
authors.forename: J
authors.initials: J
authors.lastname: Van Kerrebrouck
authors.forename: S
authors.initials: S
authors.lastname: Spiga
authors.forename: R
authors.initials: R
authors.lastname: Meyer
authors.forename: J
authors.initials: J
authors.lastname: Bauwelinck
authors.forename: R
authors.initials: R
authors.lastname: Baets
authors.forename: G
authors.initials: G
authors.lastname: Van Steenberge