title: Simultaneous Thermoelectric Property Measurement and Incoherent Phonon Transport in Holey Silicon.
abstract: Block copolymer patterned holey silicon (HS) was successfully integrated into a microdevice for simultaneous measurements of Seebeck coefficient, electrical conductivity, and thermal conductivity of the same HS microribbon. These fully integrated HS microdevices provided excellent platforms for the systematic investigation of thermoelectric transport properties tailored by the dimensions of the periodic hole array, that is, neck and pitch size, and the doping concentrations. Specifically, thermoelectric transport properties of HS with a neck size in the range of 16-34 nm and a fixed pitch size of 60 nm were characterized, and a clear neck size dependency was shown in the doping range of 3.1 × 10(18) to 6.5 × 10(19) cm(-3). At 300 K, thermal conductivity as low as 1.8 ± 0.2 W/mK was found in HS with a neck size of 16 nm, while optimized zT values were shown in HS with a neck size of 24 nm. The controllable effects of holey array dimensions and doping concentrations on HS thermoelectric performance could aid in improving the understanding of the phonon scattering process in a holey structure and also in facilitating the development of silicon-based thermoelectric devices.
authors.affiliation: Materials Sciences Division, Lawrence Berkeley National Laboratory , Berkeley, California 94720, United States.
authors.forename: Jongwoo
authors.initials: J
authors.lastname: Lim
authors.affiliation: Department of Chemical and Biological Engineering and Center for Materials for Information Technology, University of Alabama , Tuscaloosa, Alabama 35487, United States.
authors.forename: Hung-Ta
authors.initials: HT
authors.lastname: Wang
authors.affiliation: Department of Chemistry, The University of Hong Kong , Pokfulam, Hong Kong.
authors.forename: Jinyao
authors.initials: J
authors.lastname: Tang
authors.affiliation: Materials Sciences Division, Lawrence Berkeley National Laboratory , Berkeley, California 94720, United States.
authors.forename: Sean C
authors.initials: SC
authors.lastname: Andrews
authors.forename: Hongyun
authors.initials: H
authors.lastname: So
authors.affiliation: Department of Mechanical and Aerospace Engineering, University of California , Irvine, California 92697, United States.
authors.forename: Jaeho
authors.initials: J
authors.lastname: Lee
authors.affiliation: Department of Polymer Science and Engineering, Dankook University , 152, Jukjeon-ro, Suji-gu, Yongin-si, Gyeonggi-do 16890, Korea.|Department of Polymer Science and Engineering, University of Massachusetts , Amherst, Massachusetts 01003, United States.
authors.forename: Dong Hyun
authors.initials: DH
authors.lastname: Lee
authors.affiliation: Department of Polymer Science and Engineering, University of Massachusetts , Amherst, Massachusetts 01003, United States.
authors.forename: Thomas P
authors.initials: TP
authors.lastname: Russell
authors.affiliation: Materials Sciences Division, Lawrence Berkeley National Laboratory , Berkeley, California 94720, United States.
authors.forename: Peidong
authors.initials: P
authors.lastname: Yang
keywords: holey silicon; phonon transport; silicon nanostructure; thermal conductivity; thermoelectrics