title: Approaching Gas Phase Electrodeposition: Process and Optimization to Enable the Self-Aligned Growth of 3D Nanobridge-Based Interconnects.
abstract: A nanowire bonding process referred to as gas-phase electrodeposition is reported to form nanobridge-based interconnects. The process is able to grow free-standing point-to-point electrical connections using metallic wires. As a demonstration, programmable interconnects and an interdigitated electrode array are shown. The process is more material efficient when compared with conventional vapor deposition since the material is directed to the point of use.
authors.affiliation: Electrical and Computer Engineering, University of Minnesota, 200 Union St. SE, Minneapolis, MN, 55455, USA.
authors.forename: Jun
authors.initials: J
authors.lastname: Fang
authors.affiliation: Fachgebiet Nanotechnologie, Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1, D-98693, Ilmenau, Germany.
authors.forename: Leslie
authors.initials: L
authors.lastname: Schlag
authors.affiliation: Electrical and Computer Engineering, University of Minnesota, 200 Union St. SE, Minneapolis, MN, 55455, USA.
authors.forename: Se-Chul
authors.initials: SC
authors.lastname: Park
authors.affiliation: Fachgebiet Nanotechnologie, Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1, D-98693, Ilmenau, Germany.
authors.forename: Thomas
authors.initials: T
authors.lastname: Stauden
authors.affiliation: Fachgebiet Nanotechnologie, Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1, D-98693, Ilmenau, Germany.
authors.forename: Jörg
authors.initials: J
authors.lastname: Pezoldt
authors.affiliation: Fachgebiet Werkstoffe der Elektrotechnik, Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 5, D-98693, Ilmenau, Germany.
authors.forename: Peter
authors.initials: P
authors.lastname: Schaaf
authors.affiliation: Fachgebiet Nanotechnologie, Technische Universität Ilmenau, Gustav-Kirchhoff-Strasse 1, D-98693, Ilmenau, Germany.
authors.forename: Heiko O
authors.initials: HO
authors.lastname: Jacobs
keywords: electrodeposition; nanobridge-based interconnects; self-aligned nanowires; self-assembly