title: An electromechanical coupling model of a bending vibration type piezoelectric ultrasonic transducer.
abstract: An electromechanical coupling model of a bending vibration type piezoelectric ultrasonic transducer is proposed. The transducer is a Langevin type transducer which is composed of an exponential horn, four groups of PZT ceramics and a back beam. The exponential horn can focus the vibration energy, and can enlarge vibration amplitude and velocity efficiently. A bending vibration model of the transducer is first constructed, and subsequently an electromechanical coupling model is constructed based on the vibration model. In order to obtain the most suitable excitation position of the PZT ceramics, the effective electromechanical coupling coefficient is optimized by means of the quadratic interpolation method. When the effective electromechanical coupling coefficient reaches the peak value of 42.59%, the optimal excitation position (L1=22.52 mm) is found. The FEM method and the experimental method are used to validate the developed analytical model. Two groups of the FEM model (the Group A center bolt is not considered, and but the Group B center bolt is considered) are constructed and separately compared with the analytical model and the experimental model. Four prototype transducers around the peak value are fabricated and tested to validate the analytical model. A scanning laser Doppler vibrometer is employed to test the bending vibration shape and resonance frequency. Finally, the electromechanical coupling coefficient is tested indirectly through an impedance analyzer. Comparisons of the analytical results, FEM results and experiment results are presented, and the results show good agreement.
authors.affiliation: School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China. Electronic address: zhangqianghit@163.com.
authors.forename: Qiang
authors.initials: Q
authors.lastname: Zhang
authors.affiliation: School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China.
authors.forename: Shengjun
authors.initials: S
authors.lastname: Shi
authors.affiliation: School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China.
authors.forename: Weishan
authors.initials: W
authors.lastname: Chen
keywords: Bending vibration; Electromechanical coupling model; Excitation position optimization; Piezoelectric ultrasonic transducer