title: Composite vascular scaffold combining electrospun fibers and physically-crosslinked hydrogel with copper wire-induced grooves structure.
abstract: While the field of tissue engineered vascular grafts has greatly advanced, many inadequacies still exist. Successfully developed scaffolds require mechanical and structural properties that match native vessels and optimal microenvironments that foster cell integration, adhesion and growth. We have developed a small diameter, three-layered composite vascular scaffold which consists of electrospun fibers and physically-crosslinked hydrogel with copper wire-induced grooves by combining the electrospinning and dip-coating methods. Scaffold morphology and mechanics were assessed, quantified and compared to native vessels. Scaffolds were seeded with Human Umbilical Vein Endothelial Cells (HUVECs), cultured in vitro for 3 days and were evaluated for cell viability and morphology. The results showed that composite scaffolds had adjustable mechanical strength and favorable biocompatibility, which is important in the future clinical application of Tissue-engineered vascular grafts (TEVGs).
authors.affiliation: Rapid Manufacturing Engineering Center, Mechatronic Engineering and Automation of Shanghai University, Shanghai 200444, China; Shanghai Key Laboratory of Intelligent Manufacturing and Robotics, Shanghai 200444, China. Electronic address: yuanyuan_liu@shu.edu.cn.
authors.forename: Yuanyuan
authors.initials: Y
authors.lastname: Liu
authors.affiliation: Rapid Manufacturing Engineering Center, Mechatronic Engineering and Automation of Shanghai University, Shanghai 200444, China.
authors.forename: Chen
authors.initials: C
authors.lastname: Jiang
authors.affiliation: Rapid Manufacturing Engineering Center, Mechatronic Engineering and Automation of Shanghai University, Shanghai 200444, China.
authors.forename: Shuai
authors.initials: S
authors.lastname: Li
authors.affiliation: Rapid Manufacturing Engineering Center, Mechatronic Engineering and Automation of Shanghai University, Shanghai 200444, China; Shanghai Key Laboratory of Intelligent Manufacturing and Robotics, Shanghai 200444, China.
authors.forename: Qingxi
authors.initials: Q
authors.lastname: Hu
mesh_terms: D001672:Biocompatible Materials; D001696:Biomechanical Phenomena; D001807:Blood Vessel Prosthesis; D003300:Copper / Q000737:chemistry*; D061307:Human Umbilical Vein Endothelial Cells; D006801:Humans; D020100:Hydrogels / Q000737:chemistry*; D023822:Tissue Engineering; D054457:Tissue Scaffolds
chemical_list: D001672:Biocompatible Materials; D020100:Hydrogels; D003300:Copper
keywords: Dip-coating method; Electrospinning; Hydrogel; TEVGs