title: Controlled growth of Cu-Ni nanowires and nanospheres for enhanced microwave absorption properties.
abstract: Copper is a good dielectric loss material but has low stability, whereas nickel is a good magnetic loss material and is corrosion resistant but with low conductivity, therefore Cu-Ni hybrid nanostructures have synergistic advantages as microwave absorption (MA) materials. Different Cu/Ni molar ratios of bimetallic nanowires (Cu13@Ni7, Cu5@Ni5 and Cu7@Ni13) and nanospheres (Cu13@Ni7, Cu5@Ni5 and Cu1@Ni3) have been successfully synthesized via facile reduction of hydrazine under similar reaction conditions, and the morphology can be easily tuned by varying the feed ratio or the complexing agent. Apart from the concentrations of Cu(2+) and Ni(2+), the reduction parameters are similar for all samples to confirm the effects of the Cu/Ni molar ratio and morphology on MA properties. Ni is incorporated into the Cu-Ni nanomaterials as a shell over the Cu core at low temperature, as proved by XRD, SEM, TEM and XPS. Through the complex relative permittivity and permeability, reflection loss was evaluated, which revealed that the MA capacity greatly depended on the Cu/Ni molar ratio and morphology. For Cu@Ni nanowires, as the molar ratio of Ni shell increased the MA properties decreased accordingly. However, for Cu@Ni nanospheres, the opposite trend was found, that is, as the molar ratio of the Ni shell increased the MA properties increased.
authors.affiliation: College of Materials Science and Engineering, Qingdao University of Science and Technology, Qingdao 266042, China. College of Materials Science and Engineering, the Growing Base for State Key Laboratory, Qingdao University, Qingdao 266071, People's Republic of China.
authors.forename: Xiaoxia
authors.initials: X
authors.lastname: Wang
authors.forename: Lifeng
authors.initials: L
authors.lastname: Dong
authors.forename: Baoqin
authors.initials: B
authors.lastname: Zhang
authors.forename: Mingxun
authors.initials: M
authors.lastname: Yu
authors.forename: Jingquan
authors.initials: J
authors.lastname: Liu