title: A facile chemical-mechanical polishing lift-off transfer process toward large scale Cu(In,Ga)Se2 thin-film solar cells on arbitrary substrates.
abstract: The fabrication of Cu(In,Ga)Se2 (CIGS) solar cells on flexible substrates is a non-trivial task due to thermal and ion diffusion related issues. In order to circumvent these issues, we have developed a chemical-mechanical polishing lift-off (CMPL) transfer process, enabling the direct transfer of CIGS solar cells from conventional soda-lime glass (SLG) onto arbitrary flexible substrates up to 4 cm(2) in size. The structural and compositional nature of the pre- and post-transferred films is examined using electron microscopy, X-ray diffraction analysis, Raman and photoluminescence spectroscopy. We demonstrate the fabrication of solar cells on a range of flexible substrates while being able to maintain 75% cell efficiency (η) when compared to pre-transferred solar cells. The results obtained in this work suggest that our transfer process offers a highly promising approach toward large scale fabrication of CIGS-based solar cells on a wide variety of flexible substrates, suitable for use in the large scale CIGS photovoltaic industry.
authors.affiliation: Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan, Republic of China. ylchueh@mx.nthu.edu.tw.
authors.forename: Kuan-Chun
authors.initials: KC
authors.lastname: Tseng
authors.affiliation: Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan, Republic of China. ylchueh@mx.nthu.edu.tw.
authors.forename: Yu-Ting
authors.initials: YT
authors.lastname: Yen
authors.affiliation: Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, People's Republic of China and Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan, Republic of China. ylchueh@mx.nthu.edu.tw.
authors.forename: Stuart R
authors.initials: SR
authors.lastname: Thomas
authors.affiliation: Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan, Republic of China. ylchueh@mx.nthu.edu.tw.
authors.forename: Hung-Wei
authors.initials: HW
authors.lastname: Tsai
authors.affiliation: Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan, Republic of China. ylchueh@mx.nthu.edu.tw.
authors.forename: Cheng-Hung
authors.initials: CH
authors.lastname: Hsu
authors.affiliation: Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan, Republic of China. ylchueh@mx.nthu.edu.tw.
authors.forename: Wen-Chi
authors.initials: WC
authors.lastname: Tsai
authors.affiliation: National Nano Device Laboratories, No. 26, Prosperity Road 1, Hsinchu 30078, Taiwan, Republic of China.
authors.forename: Chang-Hong
authors.initials: CH
authors.lastname: Shen
authors.affiliation: National Nano Device Laboratories, No. 26, Prosperity Road 1, Hsinchu 30078, Taiwan, Republic of China.
authors.forename: Jia-Min
authors.initials: JM
authors.lastname: Shieh
authors.affiliation: Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, People's Republic of China.
authors.forename: Zhiming M
authors.initials: ZM
authors.lastname: Wang
authors.affiliation: Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan, Republic of China. ylchueh@mx.nthu.edu.tw.
authors.forename: Yu-Lun
authors.initials: YL
authors.lastname: Chueh