title: A programmable nanoreplica molding for the fabrication of nanophotonic devices.
abstract: The ability to fabricate periodic structures with sub-wavelength features has a great potential for impact on integrated optics, optical sensors, and photovoltaic devices. Here, we report a programmable nanoreplica molding process to fabricate a variety of sub-micrometer periodic patterns using a single mold. The process utilizes a stretchable mold to produce the desired periodic structure in a photopolymer on glass or plastic substrates. During the replica molding process, a uniaxial force is applied to the mold and results in changes of the periodic structure, which resides on the surface of the mold. Direction and magnitude of the force determine the array geometry, including the lattice constant and arrangement. By stretching the mold, 2D arrays with square, rectangular, and triangular lattice structures can be fabricated. As one example, we present a plasmonic crystal device with surface plasmon resonances determined by the force applied during molding. In addition, photonic crystal slabs with different array patterns are fabricated and characterized. This unique process offers the capability of generating various periodic nanostructures rapidly and inexpensively.
authors.affiliation: Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa 50011, USA.
authors.forename: Longju
authors.initials: L
authors.lastname: Liu
authors.affiliation: Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa 50011, USA.
authors.forename: Jingxiang
authors.initials: J
authors.lastname: Zhang
authors.affiliation: School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea.
authors.forename: Mohsin Ali
authors.initials: MA
authors.lastname: Badshah
authors.affiliation: Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa 50011, USA.
authors.forename: Liang
authors.initials: L
authors.lastname: Dong
authors.affiliation: Department of Mechanical Engineering, University of Hawaii, Honolulu, Hawaii 96822, USA.
authors.forename: Jingjing
authors.initials: J
authors.lastname: Li
authors.affiliation: School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea.
authors.forename: Seok-min
authors.initials: SM
authors.lastname: Kim
authors.affiliation: Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa 50011, USA.|Department of Mechanical Engineering, Iowa State University, Ames, Iowa 50011, USA.
authors.forename: Meng
authors.initials: M
authors.lastname: Lu