title: Material Gradients in Stretchable Substrates toward Integrated Electronic Functionality.
abstract: The approach toward a stretchable electronic substrate employs multiple soft polymer layers patterned around silicon chips, which act as surrogates for conventional electronics chips, to create a controllable stiffness gradient. Adding just one intermediate polymer layer results in a six-fold increase in the strain failure threshold enabling the substrate to be stretched to over twice its length before delamination occurs.
authors.affiliation: Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213, USA.
authors.forename: Naser
authors.initials: N
authors.lastname: Naserifar
authors.affiliation: Department of Mechanical Engineering, Departments of Biomedical Engineering, Computational Biology and Biological Sciences, Carnegie Mellon University, Pittsburgh, PA, 15213, USA.
authors.forename: Philip R
authors.initials: PR
authors.lastname: LeDuc
authors.affiliation: Departments of Electrical and Computer Engineering, Biomedical Engineering, Mechanical Engineering and The Robotics Institute, Carnegie Mellon University, Pittsburgh, PA, 15213, USA.
authors.forename: Gary K
authors.initials: GK
authors.lastname: Fedder
keywords: embedded silicon chips; energy strain rates; poly(dimethylsiloxane); stiffness gradients; stretchable electronics