title: High-Performance Flexible Transparent Electrode with an Embedded Metal Mesh Fabricated by Cost-Effective Solution Process.
abstract: A new structure of flexible transparent electrodes is reported, featuring a metal mesh fully embedded and mechanically anchored in a flexible substrate, and a cost-effective solution-based fabrication strategy for this new transparent electrode. The embedded nature of the metal-mesh electrodes provides a series of advantages, including surface smoothness that is crucial for device fabrication, mechanical stability under high bending stress, strong adhesion to the substrate with excellent flexibility, and favorable resistance against moisture, oxygen, and chemicals. The novel fabrication process replaces vacuum-based metal deposition with an electrodeposition process and is potentially suitable for high-throughput, large-volume, and low-cost production. In particular, this strategy enables fabrication of a high-aspect-ratio (thickness to linewidth) metal mesh, substantially improving conductivity without considerably sacrificing transparency. Various prototype flexible transparent electrodes are demonstrated with transmittance higher than 90% and sheet resistance below 1 ohm sq(-1) , as well as extremely high figures of merit up to 1.5 × 10(4) , which are among the highest reported values in recent studies. Finally using our embedded metal-mesh electrode, a flexible transparent thin-film heater is demonstrated with a low power density requirement, rapid response time, and a low operating voltage.
authors.affiliation: Department of Mechanical Engineering, The University of Hong Kong, Pokfulam, Hong Kong, China.
authors.forename: Arshad
authors.initials: A
authors.lastname: Khan
authors.affiliation: Department of Mechanical Engineering, The University of Michigan, Ann Arbor, MI, 48109, USA.
authors.forename: Sangeon
authors.initials: S
authors.lastname: Lee
authors.affiliation: Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI, 48109, USA.
authors.forename: Taehee
authors.initials: T
authors.lastname: Jang
authors.affiliation: Department of Chemistry, The University of Hong Kong, Pokfulam, Hong Kong, China.
authors.forename: Ze
authors.initials: Z
authors.lastname: Xiong
authors.affiliation: Department of Mechanical Engineering, The University of Hong Kong, Pokfulam, Hong Kong, China.|HKU-Shenzhen Institute of Research and Innovation (HKU-SIRI), Shenzhen, China.
authors.forename: Cuiping
authors.initials: C
authors.lastname: Zhang
authors.affiliation: Department of Chemistry, The University of Hong Kong, Pokfulam, Hong Kong, China.
authors.forename: Jinyao
authors.initials: J
authors.lastname: Tang
authors.affiliation: Department of Mechanical Engineering, The University of Michigan, Ann Arbor, MI, 48109, USA.|Department of Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, MI, 48109, USA.
authors.forename: L Jay
authors.initials: LJ
authors.lastname: Guo
authors.affiliation: Department of Mechanical Engineering, The University of Hong Kong, Pokfulam, Hong Kong, China.|HKU-Shenzhen Institute of Research and Innovation (HKU-SIRI), Shenzhen, China.
authors.forename: Wen-Di
authors.initials: WD
authors.lastname: Li
keywords: electrodeposition; embedded metal-mesh; flexible transparent electrodes; solution processed; transparent thin-film heaters