title: Electrodeposition of Gold to Conformally Fill High Aspect Ratio Nanometric Silicon Grating Trenches: A Comparison of Pulsed and Direct Current Protocols.
abstract: Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of x-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures.
authors.affiliation: Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD 20892.
authors.forename: Sami A
authors.initials: SA
authors.lastname: Znati
authors.affiliation: Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD 20892.
authors.forename: Nicholas
authors.initials: N
authors.lastname: Chedid
authors.affiliation: Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD 20892.
authors.forename: Houxun
authors.initials: H
authors.lastname: Miao
authors.affiliation: Center for Nanoscale Science and Technology, National Institute of Standards and Technology, Gaithersburg, MD 20899.
authors.forename: Lei
authors.initials: L
authors.lastname: Chen
authors.affiliation: Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD 20892.
authors.forename: Eric E
authors.initials: EE
authors.lastname: Bennett
authors.affiliation: Imaging Physics Laboratory, Biochemistry and Biophysics Center, National Heart, Lung and Blood Institute, National Institutes of Health, Bethesda, MD 20892.
authors.forename: Han
authors.initials: H
authors.lastname: Wen
keywords: ALD adhesive layer; Pulsed Electroplating; atomic layer deposition; direct current electrodeposition; gold electrodepostion; gold electroplating; grating filling; high aspect ratio trenches; platinum seedlayer; pulsed vs. direct current electroplating; silicon trench gratings; trench filling