title: An innovative approach to predict technology evolution for the desoldering of printed circuit boards: A perspective from China and America.
abstract: The printed circuit boards basis of electronic equipment have seen a rapid growth in recent years and played a significant role in modern life. Nowadays, the fact that electronic devices upgrade quickly necessitates a proper management of waste printed circuit boards. Non-destructive desoldering of waste printed circuit boards becomes the first and the most crucial step towards recycling electronic components. Owing to the diversity of materials and components, the separation process is difficult, which results in complex and expensive recovery of precious materials and electronic components from waste printed circuit boards. To cope with this problem, we proposed an innovative approach integrating Theory of Inventive Problem Solving (TRIZ) evolution theory and technology maturity mapping system to forecast the evolution trends of desoldering technology of waste printed circuit boards. This approach can be applied to analyse the technology evolution, as well as desoldering technology evolution, then research and development strategy and evolution laws can be recommended. As an example, the maturity of desoldering technology is analysed with a technology maturity mapping system model. What is more, desoldering methods in different stages are analysed and compared. According to the analysis, the technological evolution trends are predicted to be 'the law of energy conductivity' and 'increasing the degree of idealisation'. And the potential technology and evolutionary state of waste printed circuit boards are predicted, offering reference for future waste printed circuit boards recycling.
authors.affiliation: School of Manufacturing Science & Engineering, Sichuan University, Chengdu, China.
authors.forename: Chen
authors.initials: C
authors.lastname: Wang
authors.affiliation: School of Manufacturing Science & Engineering, Sichuan University, Chengdu, China zhaowu@scu.edu.cn.
authors.forename: Wu
authors.initials: W
authors.lastname: Zhao
authors.affiliation: School of Manufacturing Science & Engineering, Sichuan University, Chengdu, China.
authors.forename: Jie
authors.initials: J
authors.lastname: Wang
authors.affiliation: Division of Production and Materials Engineering, Lund University, Lund, Sweden.
authors.forename: Ling
authors.initials: L
authors.lastname: Chen
authors.affiliation: School of Manufacturing Science & Engineering, Sichuan University, Chengdu, China.
authors.forename: Chun-Jing
authors.initials: CJ
authors.lastname: Luo
mesh_terms: D002681:China; D059029:Electronic Waste; D062069:Inventions; D008962:Models, Theoretical; D009656:North America; D010330:Patents as Topic; D059027:Recycling / Q000639:trends; D012037:Refuse Disposal / Q000379:methods*
keywords: TRIZ; Waste printed circuit board; desoldering; ideal final result; technology life cycle