title: Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications.
abstract: Copper nanomaterials suffer from severe oxidation problem despite the huge cost effectiveness. The effect of two different processes for conventional tube furnace heating and selective laser sintering on copper nanoparticle paste is compared in the aspects of chemical, electrical and surface morphology. The thermal behavior of the copper thin films by furnace and laser is compared by SEM, XRD, FT-IR, and XPS analysis. The selective laser sintering process ensures low annealing temperature, fast processing speed with remarkable oxidation suppression even in air environment while conventional tube furnace heating experiences moderate oxidation even in Ar environment. Moreover, the laser-sintered copper nanoparticle thin film shows good electrical property and reduced oxidation than conventional thermal heating process. Consequently, the proposed selective laser sintering process can be compatible with plastic substrate for copper based flexible electronics applications.
authors.affiliation: Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University , 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea.
authors.forename: Jinhyeong
authors.initials: J
authors.lastname: Kwon
authors.affiliation: Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University , 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea.
authors.forename: Hyunmin
authors.initials: H
authors.lastname: Cho
authors.affiliation: Surface Technology R&BD Group, Korea Institute of Industrial Technology (KITECH) , 156 Gaetbeol-ro, Yeonsu-gu, Incheon, 21999, Korea.
authors.forename: Hyeonjin
authors.initials: H
authors.lastname: Eom
authors.affiliation: Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University , 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea.
authors.forename: Habeom
authors.initials: H
authors.lastname: Lee
authors.affiliation: Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University , 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea.
authors.forename: Young Duk
authors.initials: YD
authors.lastname: Suh
authors.affiliation: Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University , 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea.
authors.forename: Hyunjin
authors.initials: H
authors.lastname: Moon
authors.affiliation: Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University , 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea.
authors.forename: Jaeho
authors.initials: J
authors.lastname: Shin
authors.affiliation: Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University , 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea.
authors.forename: Sukjoon
authors.initials: S
authors.lastname: Hong
authors.affiliation: Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University , 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Korea.
authors.forename: Seung Hwan
authors.initials: SH
authors.lastname: Ko
keywords: copper nanoparticle; flexible substrate; low temperature process; oxidation suppression; selective laser sintering; surface analysis; touch panel