title: Note: Near infrared interferometric silicon wafer metrology.
abstract: In this investigation, two near infrared (NIR) interferometric techniques for silicon wafer metrology are described and verified with experimental results. Based on the transparent characteristic of NIR light to a silicon wafer, the fiber based spectrally resolved interferometry can measure the optical thickness of the wafer and stitching low coherence scanning interferometry can reconstruct entire surfaces of the wafer.
authors.affiliation: Department of Photonic Engineering, Chosun University, Gwangju 61452, South Korea.
authors.forename: M S
authors.initials: MS
authors.lastname: Choi
authors.affiliation: Department of Photonic Engineering, Chosun University, Gwangju 61452, South Korea.
authors.forename: H M
authors.initials: HM
authors.lastname: Park
authors.affiliation: Department of Photonic Engineering, Chosun University, Gwangju 61452, South Korea.
authors.forename: K N
authors.initials: KN
authors.lastname: Joo