title: Thermal Conductivity of Epoxy Resin Composites Filled with Combustion Synthesized h-BN Particles.
abstract: The thermal conductivity of epoxy resin composites filled with combustion-synthesized hexagonal boron nitride (h-BN) particles was investigated. The mixing of the composite constituents was carried out by either a dry method (involving no use of solvent) for low filler loadings or a solvent method (using acetone as solvent) for higher filler loadings. It was found that surface treatment of the h-BN particles using the silane 3-glycidoxypropyltrimethoxysilane (GPTMS) increases the thermal conductivity of the resultant composites in a lesser amount compared to the values reported by other studies. This was explained by the fact that the combustion synthesized h-BN particles contain less -OH or active sites on the surface, thus adsorbing less amounts of GPTMS. However, the thermal conductivity of the composites filled with the combustion synthesized h-BN was found to be comparable to that with commercially available h-BN reported in other studies. The thermal conductivity of the composites was found to be higher when larger h-BN particles were used. The thermal conductivity was also found to increase with increasing filler content to a maximum and then begin to decrease with further increases in this content. In addition to the effect of higher porosity at higher filler contents, more horizontally oriented h-BN particles formed at higher filler loadings (perhaps due to pressing during formation of the composites) were suggested to be a factor causing this decrease of the thermal conductivity. The measured thermal conductivities were compared to theoretical predictions based on the Nielsen and Lewis theory. The theoretical predictions were found to be lower than the experimental values at low filler contents (< 60 vol %) and became increasing higher than the experimental values at high filler contents (> 60 vol %).
authors.affiliation: Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 70101, Taiwan. slchung@mail.ncku.edu.tw.|Department of Chemical Engineering, National Cheng Kung University, Tainan 70101, Taiwan. slchung@mail.ncku.edu.tw.
authors.forename: Shyan-Lung
authors.initials: SL
authors.lastname: Chung
authors.affiliation: Department of Chemical Engineering, National Cheng Kung University, Tainan 70101, Taiwan. N38981232@mail.ncku.edu.tw.
authors.forename: Jeng-Shung
authors.initials: JS
authors.lastname: Lin
mesh_terms: D001896:Boron Compounds / Q000737:chemistry*; D003188:Composite Resins / Q000737:chemistry*; D004852:Epoxy Compounds / Q000737:chemistry; D004853:Epoxy Resins / Q000737:chemistry*; D012821:Silanes / Q000737:chemistry; D013814:Thermal Conductivity
chemical_list: C000616917:3-glycidyloxypropyltrimethoxysilane; D001896:Boron Compounds; D003188:Composite Resins; D004852:Epoxy Compounds; D004853:Epoxy Resins; D012821:Silanes; C017282:boron nitride
keywords: h-BN/Epoxy resin composites; hexagonal boron nitride (h-BN); self-propagating high temperature synthesis (SHS); thermal conductivity