title: Thermally Conductive-Silicone Composites with Thermally Reversible Cross-links.
abstract: Thermally conductive-silicone composites that contain thermally reversible cross-links were prepared by blending diene- and dienophile-functionalized polydimethylsiloxane (PDMS) with an aluminum oxide conductive filler. This class of thermally conductive-silicones are useful as thermal interface materials (TIMs) within Information Technology (IT) hardware applications to allow rework of valuable components. The composites were rendered reworkable via retro Diels-Alder cross-links when temperatures were elevated above 130 °C and required little mechanical force to remove, making them advantageous over other TIM materials. Results show high thermal conductivity (0.4 W/m·K) at low filler loadings (45 wt %) compared to other TIM solutions (>45 wt %). Additionally, the adhesion of the material was found to be ∼7 times greater at lower temperatures (25 °C) and ∼2 times greater at higher temperatures (120 °C) than commercially available TIMs.
authors.affiliation: IBM Corporation , Poughkeepsie, New York 12601, United States.
authors.forename: J T
authors.initials: JT
authors.lastname: Wertz
authors.affiliation: IBM Corporation , Tampa, Florida 33607, United States.
authors.forename: J P
authors.initials: JP
authors.lastname: Kuczynski
authors.affiliation: IBM Corporation , Tucson, Arizona 85744, United States.
authors.forename: D J
authors.initials: DJ
authors.lastname: Boday
keywords: Diels−Alder; reversible; silicones; thermal interface materials; thermally conductive