Heterogeneously Assembled Metamaterials and Metadevices via 3D Modular Transfer Printing.
Metamaterials have made the exotic control of the flow of electromagnetic waves possible, which is difficult to achieve with natural materials. In recent years, the emergence of functional metadevices has shown immense potential for the practical realization of highly efficient photonic devices. However, complex and heterogeneous architectures that enable diverse functionalities of metamaterials and metadevices have been challenging to realize because of the limited manufacturing capabilities of conventional fabrication methods. Here, we show that three-dimensional (3D) modular transfer printing can be used to construct diverse metamaterials in complex 3D architectures on universal substrates, which is attractive for achieving on-demand photonic properties. Few repetitive processing steps and rapid constructions are additional advantages of 3D modular transfer printing. Thus, this method provides a fascinating route to generate flexible and stretchable 2D/3D metamaterials and metadevices with heterogeneous material components, complex device architectures, and diverse functionalities.
SKKU Advanced Institute of Nanotechnology (SAINT) &School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea.
Seungwoo
S
Lee
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
Byungsoo
B
Kang
Department of Mechanical Science and Engineering, University of Illinois, Urbana-Champaign, Illinois 61801, USA.
Hohyun
H
Keum
Department of Mechanical Science and Engineering, University of Illinois, Urbana-Champaign, Illinois 61801, USA.
Numair
N
Ahmed
Department of Materials Science and Engineering, University of Illinois, Urbana-Champaign, Illinois 61801, USA.
John A
JA
Rogers
Department of Mechanical Science and Engineering, University of Illinois, Urbana-Champaign, Illinois 61801, USA.
Placid M
PM
Ferreira
Department of Mechanical Science and Engineering, University of Illinois, Urbana-Champaign, Illinois 61801, USA.
Seok
S
Kim
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
Bumki
B
Min