Plasma-Enhanced Atomic Layer Deposition of SiN-AlN Composites for Ultra Low Wet Etch Rates in Hydrofluoric Acid.
The continued scaling in transistors and memory elements has necessitated the development of atomic layer deposited (ALD) of hydrofluoric acid (HF) etch resistant and electrically insulating films for sidewall spacer processing. Silicon nitride (SiN) has been the prototypical material for this need and extensive work has been conducted into realizing sufficiently lower wet etch rates (WERs) as well as leakage currents to meet industry needs. In this work, we report on the development of plasma-enhanced atomic layer deposition (PEALD) composites of SiN and AlN to minimize WER and leakage current density. In particular, the role of aluminum and the optimum amount of Al contained in the composite structures have been explored. Films with near zero WER in dilute HF and leakage currents density similar to pure PEALD SiN films could be simultaneously realized through composites which incorporate ≥13 at. % Al, with a maximum thermal budget of 350 °C.
Yongmin
Y
Kim
J
J
Provine
Stephen P
SP
Walch
Joonsuk
J
Park
Witchukorn
W
Phuthong
Anup L
AL
Dadlani
Hyo-Jin
HJ
Kim
Peter
P
Schindler
Manufacturing Technology Center, Samsung Electronics , Suwon, Gyeonggi-Do South Korea.
Kihyun
K
Kim
Fritz B
FB
Prinz
aluminum incorporation; composite; composite films; plasma-enhanced atomic layer deposition (PEALD); silicon nitride; thin film deposition; wet etch