title: Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters.
abstract: We present the first III-V opto-electronic components transfer printed on and coupled to a silicon photonic integrated circuit. Thin InP-based membranes are transferred to an SOI waveguide circuit, after which a single-spatial-mode broadband light source is fabricated. The process flow to create transfer print-ready coupons is discussed. Aqueous FeCl3at 5°C was found to be the best release agent in combination with the photoresist anchoring structures that were used. A thin DVS-BCB layer provides a strong bond, accommodating the post-processing of the membranes. The resulting optically pumped LED has a 3 dB bandwidth of 130 nm, comparable to devices realized using a traditional die-to-wafer bonding method.
authors.forename: Andreas
authors.initials: A
authors.lastname: De Groote
authors.forename: Paolo
authors.initials: P
authors.lastname: Cardile
authors.forename: Ananth Z
authors.initials: AZ
authors.lastname: Subramanian
authors.forename: Alin M
authors.initials: AM
authors.lastname: Fecioru
authors.forename: Christopher
authors.initials: C
authors.lastname: Bower
authors.forename: Danae
authors.initials: D
authors.lastname: Delbeke
authors.forename: Roel
authors.initials: R
authors.lastname: Baets
authors.forename: Günther
authors.initials: G
authors.lastname: Roelkens