title: Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM).
abstract: Three-dimensional (3D) nondestructive microstructural characterization was performed using full-field transmission X-ray microscopy on an Sn-rich alloy, at a spatial resolution of 60 nm. This study highlights the use of synchrotron radiation along with Fresnel zone plate optics to perform absorption contrast tomography for analyzing nanoscale features of fine second phase particles distributed in the tin matrix, which are representative of the bulk microstructure. The 3D reconstruction was also used to quantify microstructural details of the analyzed volume.
authors.affiliation: 1Materials Science and Engineering,Arizona State University,Tempe,AZ 85287-6106,USA.
authors.forename: Chandrashekara S
authors.initials: CS
authors.lastname: Kaira
authors.affiliation: 1Materials Science and Engineering,Arizona State University,Tempe,AZ 85287-6106,USA.
authors.forename: Carl R
authors.initials: CR
authors.lastname: Mayer
authors.affiliation: 2Advanced Photon Source,Argonne National Laboratory,Building 401,9700 S. Cass Avenue,Argonne,IL 60439,USA.
authors.forename: V
authors.initials: V
authors.lastname: De Andrade
authors.affiliation: 2Advanced Photon Source,Argonne National Laboratory,Building 401,9700 S. Cass Avenue,Argonne,IL 60439,USA.
authors.forename: Francesco
authors.initials: F
authors.lastname: De Carlo
authors.affiliation: 1Materials Science and Engineering,Arizona State University,Tempe,AZ 85287-6106,USA.
authors.forename: Nikhilesh
authors.initials: N
authors.lastname: Chawla
keywords: X-ray synchrotron; intermetallics; lead-free solder; transmission X-ray microscopy