title: The Electrical Properties for Phenolic Isocyanate-Modified Bisphenol-Based Epoxy Resins Comprising Benzoate Group.
abstract: Epoxy resin has been required to have a low dielectric constant (D(k)), low dissipation factor (Df), low coefficient of thermal expansion (CTE), low water absorption, high mechanical, and high adhesion properties for various applications. A series of novel phenolic isocyanate-modified bisphenol-based epoxy resins comprising benzoate group were prepared for practical electronic packaging applications. The developed epoxy resins showed highly reduced dielectric constants (D(k)-3.00 at 1 GHz) and low dissipation values (Df-0.014 at 1 GHz) as well as enhanced thermal properties.
authors.forename: Eun Yong
authors.initials: EY
authors.lastname: Lee
authors.forename: Il Seok
authors.initials: IS
authors.lastname: Chae
authors.forename: Dongkyung
authors.initials: D
authors.lastname: Park
authors.forename: Hongsuk
authors.initials: H
authors.lastname: Suh
authors.forename: Sang Wook
authors.initials: SW
authors.lastname: Kang
mesh_terms: D001559:Benzhydryl Compounds / Q000737:chemistry*; D003510:Cyclohexanes / Q000737:chemistry*; D004853:Epoxy Resins / Q000737:chemistry*; D017953:Isocyanates / Q000737:chemistry*; D019800:Phenol / Q000737:chemistry*; D017550:Spectroscopy, Fourier Transform Infrared; D000098704:Bisphenols
chemical_list: D001559:Benzhydryl Compounds; D003510:Cyclohexanes; D004853:Epoxy Resins; D017953:Isocyanates; D019800:Phenol; C517113:bisphenol Z; D000098704:Bisphenols