title: Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory.
abstract: Ultrathin silicon-based flexible 16 × 16 NAND flash memory (f-NAND) is demonstrated utilizing roll-to-plate packaging. The roll-based thermo-compression bonding of the anisotropic conductive film (ACF) transfers and simultaneously interconnects the f-NAND on a flexible printed circuit board. Reliable circuitry operation of the 16 × 16 f-NAND is confirmed with excellent flexibility and stable ACF interconnections.
authors.affiliation: Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea.
authors.forename: Do Hyun
authors.initials: DH
authors.lastname: Kim
authors.affiliation: Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea.
authors.forename: Hyeon Gyun
authors.initials: HG
authors.lastname: Yoo
authors.affiliation: Department of Nano Mechanics, Nano-Convergence Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-ro, Yuseong-gu, Daejeon, 305-343, Republic of Korea.
authors.forename: Sung Min
authors.initials: SM
authors.lastname: Hong
authors.affiliation: Department of Nano Mechanics, Nano-Convergence Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-ro, Yuseong-gu, Daejeon, 305-343, Republic of Korea.
authors.forename: Bongkyun
authors.initials: B
authors.lastname: Jang
authors.affiliation: Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea.
authors.forename: Dae Yong
authors.initials: DY
authors.lastname: Park
authors.affiliation: Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea.
authors.forename: Daniel J
authors.initials: DJ
authors.lastname: Joe
authors.affiliation: Department of Nano Mechanics, Nano-Convergence Mechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-ro, Yuseong-gu, Daejeon, 305-343, Republic of Korea. jaehkim@kimm.re.kr.
authors.forename: Jae-Hyun
authors.initials: JH
authors.lastname: Kim
authors.affiliation: Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 305-701, Republic of Korea. keonlee@kaist.ac.kr.
authors.forename: Keon Jae
authors.initials: KJ
authors.lastname: Lee
keywords: flexible ACF packaging; flexible NAND flash memory; roll-to-plate technology; ultrathin silicon-based flexible electronics