title: Deterministic Integration of Out-of-Plane Sensor Arrays for Flexible Electronic Applications.
abstract: A design strategy for fully flexible electrode arrays with out-of-plane through polymer vias (TPVs) for monolithic 3D integration of sensor readout circuitry is presented. The TPVs are formed using copper embedded in thin polyimide structure for support. The copper interconnects offer a stable impedance frequency response from DC to 100 kHz (Z ≈ 20 Ω, θ ≈ 0°).
authors.affiliation: Integrated Nanotechnology Laboratory and Integrated Disruptive Electronic Applications Laboratory (IDEA) Laboratory, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955, Saudi Arabia.
authors.forename: Aftab M
authors.initials: AM
authors.lastname: Hussain
authors.affiliation: Integrated Nanotechnology Laboratory and Integrated Disruptive Electronic Applications Laboratory (IDEA) Laboratory, King Abdullah University of Science and Technology (KAUST), Thuwal, 23955, Saudi Arabia. muhammadmustafa.hussain@kaust.edu.sa.
authors.forename: Muhammad M
authors.initials: MM
authors.lastname: Hussain
keywords: 3D integration; flexible electronics; sensors; through polymer vias