title: Accurate measurements of cross-plane thermal conductivity of thin films by dual-frequency time-domain thermoreflectance (TDTR).
abstract: Accurate measurements of the cross-plane thermal conductivity Λcross of a high-thermal-conductivity thin film on a low-thermal-conductivity (Λs) substrate (e.g., Λcross/Λs > 20) are challenging, due to the low thermal resistance of the thin film compared with that of the substrate. In principle, Λcross could be measured by time-domain thermoreflectance (TDTR), using a high modulation frequency fh and a large laser spot size. However, with one TDTR measurement at fh, the uncertainty of the TDTR measurement is usually high due to low sensitivity of TDTR signals to Λcross and high sensitivity to the thickness hAl of Al transducer deposited on the sample for TDTR measurements. We observe that in most TDTR measurements, the sensitivity to hAl only depends weakly on the modulation frequency f. Thus, we performed an additional TDTR measurement at a low modulation frequency f0, such that the sensitivity to hAl is comparable but the sensitivity to Λcross is near zero. We then analyze the ratio of the TDTR signals at fh to that at f0, and thus significantly improve the accuracy of our Λcross measurements. As a demonstration of the dual-frequency approach, we measured the cross-plane thermal conductivity of a 400-nm-thick nickel-iron alloy film and a 3-μm-thick Cu film, both with an accuracy of ∼10%. The dual-frequency TDTR approach is useful for future studies of thin films.
authors.affiliation: Department of Mechanical Engineering, National University of Singapore, Singapore 117576.
authors.forename: Puqing
authors.initials: P
authors.lastname: Jiang
authors.affiliation: Department of Mechanical Engineering, National University of Singapore, Singapore 117576.
authors.forename: Bin
authors.initials: B
authors.lastname: Huang
authors.affiliation: Department of Mechanical Engineering, National University of Singapore, Singapore 117576.
authors.forename: Yee Kan
authors.initials: YK
authors.lastname: Koh