title: Selective separation of copper over solder alloy from waste printed circuit boards leach solution.
abstract: The printed circuit boards (PCBs) from electronic waste are important resource, since the PCBs contain precious metals such as gold, copper, tin, silver, platinum and so forth. In addition to the economic point of view, the presence of lead turns this scrap into dangerous to environment. This study was conducted as part of the development of a novel process for selective recovery of copper over tin and lead from printed circuit boards by HBF4leaching. In previous study, Copper with solder alloy was associated, simultaneously were leached in HBF4solution using hydrogen peroxide as an oxidant at room temperature. The objective of this study is the separation of copper from tin and lead from Fluoroborate media using CP-150 as an extractant. The influence of organic solvent's concentration, pH, temperature and A/O phase ratio was investigated. The possible extraction mechanism and the composition of the extracted species have been determined. The separation factors for these metals using this agent are reported, while efficient methods for separation of Cu (II) from other metal ions are proposed. The treatment of leach liquor for solvent extraction of copper with CP-150 revealed that 20% CP-150 in kerosene, a 30min period of contact time, and a pH of 3 were sufficient for the extraction of Cu(II) and 99.99% copper was recovered from the leached solution.
authors.affiliation: Department of Mining and Metallurgical Engineering, Amirkabir University of Technology, Tehran, Iran.
authors.forename: Maryam
authors.initials: M
authors.lastname: Kavousi
authors.affiliation: Department of Mining and Metallurgical Engineering, Amirkabir University of Technology, Tehran, Iran.
authors.forename: Anahita
authors.initials: A
authors.lastname: Sattari
authors.affiliation: Department of Mining and Metallurgical Engineering, Amirkabir University of Technology, Tehran, Iran. Electronic address: alamdari@aut.ac.ir.
authors.forename: Eskandar Keshavarz
authors.initials: EK
authors.lastname: Alamdari
authors.affiliation: Department of Mining and Metallurgical Engineering, Amirkabir University of Technology, Tehran, Iran.
authors.forename: Sadegh
authors.initials: S
authors.lastname: Firozi
mesh_terms: D000497:Alloys / Q000737:chemistry*; D005591:Chemical Fractionation / Q000379:methods; D003300:Copper / Q000737:chemistry / Q000302:isolation & purification*; D059029:Electronic Waste; D006863:Hydrogen-Ion Concentration; D059027:Recycling / Q000379:methods*; D012996:Solutions / Q000737:chemistry; D013696:Temperature
chemical_list: D000497:Alloys; D012996:Solutions; D003300:Copper
keywords: CP-150; Fluoroboricacid; Printed circuit boards; Solvent extraction