Surface phononic graphene.
Strategic manipulation of wave and particle transport in various media is the key driving force for modern information processing and communication. In a strongly scattering medium, waves and particles exhibit versatile transport characteristics such as localization, tunnelling with exponential decay, ballistic, and diffusion behaviours due to dynamical multiple scattering from strong scatters or impurities. Recent investigations of graphene have offered a unique approach, from a quantum point of view, to design the dispersion of electrons on demand, enabling relativistic massless Dirac quasiparticles, and thus inducing low-loss transport either ballistically or diffusively. Here, we report an experimental demonstration of an artificial phononic graphene tailored for surface phonons on a LiNbO3integrated platform. The system exhibits Dirac quasiparticle-like transport, that is, pseudo-diffusion at the Dirac point, which gives rise to a thickness-independent temporal beating for transmitted pulses, an analogue of Zitterbewegung effects. The demonstrated fully integrated artificial phononic graphene platform here constitutes a step towards on-chip quantum simulators of graphene and unique monolithic electro-acoustic integrated circuits.
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.
Si-Yuan
SY
Yu
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.
Xiao-Chen
XC
Sun
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.
Xu
X
Ni
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.
Qing
Q
Wang
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.
Xue-Jun
XJ
Yan
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.
Cheng
C
He
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.|Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Xiao-Ping
XP
Liu
Department of Electrical Engineering, The State University of New York at Buffalo, Buffalo, New York 14260, USA.
Liang
L
Feng
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.|Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Ming-Hui
http://orcid.org/0000-0003-0401-9844
MH
Lu
National Laboratory of Solid-State Microstructures and Department of Materials Science and Engineering, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China.|Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China.
Yan-Feng
YF
Chen