Design of Stretchable Electronics Against Impact.
Stretchable electronics offer soft, biocompatible mechanical properties; these same properties make them susceptible to device failure associated with physical impact. This paper studies designs for stretchable electronics that resist failure from impacts due to incorporation of a viscoelastic encapsulation layer. Results indicate that the impact resistance depends on the thickness and viscoelastic properties of the encapsulation layer, as well as the duration of impact. An analytic model for the critical thickness of the encapsulation layer is established. It is shown that a commercially available, low modulus silicone material offers viscous properties that make it a good candidate as the encapsulation layer for stretchable electronics.
Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China;
J H
JH
Yuan
Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
M
M
Pharr
Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China;
X
X
Feng
Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
John A
JA
Rogers
Departments of Civil and Environmental Engineering, Mechanical Engineering, and Material Science and Engineering, Northwestern University, Evanston, IL 60208;
Yonggang
Y
Huang
impact loading; stretchable electronics; viscoelasticity