Efficient, tunable flip-chip-integrated III-V/Si hybrid external-cavity laser array.
We demonstrate a surface-normal coupled tunable hybrid silicon laser array for the first time using passively-aligned, high-accuracy flip chip bonding. A 2x6 III-V reflective semiconductor optical amplifier (RSOA) array with integrated total internal reflection mirrors is bonded to a CMOS SOI chip with grating couplers and silicon ring reflectors to form a tunable hybrid external-cavity laser array. Waveguide-coupled wall plug efficiency (wcWPE) of 2% and output power of 3 mW has been achieved for all 12 lasers. We further improved the performance by reducing the thickness of metal/dielectric stacks and achieved 10mW output power and 5% wcWPE with the same integration techniques. This non-invasive, one-step back end of the line (BEOL) integration approach provides a promising solution to high density laser sources for future large-scale photonic integrated circuits.
Shiyun
S
Lin
Xuezhe
X
Zheng
Jin
J
Yao
Stevan S
SS
Djordjevic
John E
JE
Cunningham
Jin-Hyoung
JH
Lee
Ivan
I
Shubin
Ying
Y
Luo
Jock
J
Bovington
Daniel Y
DY
Lee
Hiren D
HD
Thacker
Kannan
K
Raj
Ashok V
AV
Krishnamoorthy