Contactless microparticle control via ultrahigh frequency needle type single beam acoustic tweezers.
This paper reports on contactless microparticle manipulation including single-particle controlled trapping, transportation, and patterning via single beam acoustic radiation forces. As the core component of single beam acoustic tweezers, a needle type ultrasonic transducer was designed and fabricated with center frequency higher than 300 MHz and -6 dB fractional bandwidth as large as 64%. The transducer was built for anf-number close to 1.0, and the desired focal depth was achieved by press-focusing technology. Its lateral resolution was measured to be better than 6.7μm by scanning a 4μm tungsten wire target. Tightly focused acoustic beam produced by the transducer was shown to be capable of manipulating individual microspheres as small as 3μm. "USC" patterning with 15μm microspheres was demonstrated without affecting nearby microspheres. These promising results may expand the applications in biomedical and biophysical research of single beam acoustic tweezers.
Chunlong
C
Fei
NIH Resource Center for Medical Ultrasonic Transducer Technology and Department of Biomedical Engineering, University of Southern California , Los Angeles, California 90089, USA.
Ying
Y
Li
School of Optical and Electronic Information, Huazhong University of Science and Technology , Wuhan 430074, China.
Benpeng
B
Zhu
NIH Resource Center for Medical Ultrasonic Transducer Technology and Department of Biomedical Engineering, University of Southern California , Los Angeles, California 90089, USA.
Chi Tat
CT
Chiu
NIH Resource Center for Medical Ultrasonic Transducer Technology and Department of Biomedical Engineering, University of Southern California , Los Angeles, California 90089, USA.
Zeyu
Z
Chen
School of Microelectronics, Xidian University , Xi'an 710071, China.
Di
D
Li
School of Microelectronics, Xidian University , Xi'an 710071, China.
Yintang
Y
Yang
NIH Resource Center for Medical Ultrasonic Transducer Technology and Department of Biomedical Engineering, University of Southern California , Los Angeles, California 90089, USA.
K
K
Kirk Shung
Qifa
Q
Zhou