Deposition of hermetic silver shells onto copper flakes.
Continuous silver shells were deposited on copper flakes using a two-stage precipitation process. A tightly packed layer of silver nanoparticles was first formed on the surface of the base metal by galvanic displacement. The size of the noble metal particles and their distribution on the substrate were controlled using complexing agents and dispersants. A continuous Ag deposit was subsequently grown by reducing slowly [Ag(NH3)2]+ions with glucose. The final shell thickness was controlled by varying the amount of metal deposited in the second step. The electrical properties of resulting silver coated copper flakes are comparable to those measured for silver flakes of similar size and aspect ratio. By preventing the oxidation of copper cores up to 400°C, the hermetic noble metal shell dramatically extends the temperature range in which Ag/Cu flakes can successfully replace pure silver.
Center for Advanced Materials Processing, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699-5814, USA.
John I
JI
Njagi
Center for Advanced Materials Processing, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699-5814, USA.
Christopher M
CM
Netzband
Center for Advanced Materials Processing, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699-5814, USA. Electronic address: goiadanv@clarkson.edu.
Dan V
DV
Goia
Copper flakes; Electroless plating; Galvanic displacement; Glucose; Silver diamine; Silver nanoparticles