Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability.
Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520 °C and a glass transition temperature (Tg) around 386 °C. Stable dielectric constant and low dielectric loss are observed for this film in the frequency range of 100-200 kHz and in the temperature range of 25-300 °C. The temperature coefficient of dielectric constant is less than 0.001 °C-1even at 400 °C. By cycling heating and cooling up to ten times or heating at 300 °C for 12 h, the film shows good reversibility and robustness of the dielectric properties. This crosslinked PEN film will be a potential candidate as high performance film capacitor electronic devices materials used at high temperature.
Research Branch of Advanced Functional Materials, School of Microelectronics and Solid-State Electronics, High Temperature Resistant Polymer and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Ruiqi
R
Yang
Research Branch of Advanced Functional Materials, School of Microelectronics and Solid-State Electronics, High Temperature Resistant Polymer and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Renbo
R
Wei
Research Branch of Advanced Functional Materials, School of Microelectronics and Solid-State Electronics, High Temperature Resistant Polymer and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Kui
K
Li
Research Branch of Advanced Functional Materials, School of Microelectronics and Solid-State Electronics, High Temperature Resistant Polymer and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Lifen
L
Tong
Research Branch of Advanced Functional Materials, School of Microelectronics and Solid-State Electronics, High Temperature Resistant Polymer and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Kun
K
Jia
Research Branch of Advanced Functional Materials, School of Microelectronics and Solid-State Electronics, High Temperature Resistant Polymer and Composites Key Laboratory of Sichuan Province, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Xiaobo
X
Liu