title: Parallel glide: flow of dislocations with internal stress source/sink distribution.
abstract: The unexpected glide of dislocations on a plane parallel to the film/substrate interface in ultrathin copper films, which has been calledparallel glide(Balket al2003Acta Metall.51447), is described using an analytical model. The phenomenon is observed as a problem involving inlet/outlet flow from different positions of a grain boundary into the grain channel. In this sense, parallel glide is presented as the flow of dislocations with an internal stress source/sink distribution.
authors.affiliation: Faculty of Technology and Metallurgy, Belgrade University, Karnegijeva 4, POB 3503, 11120 Belgrade, Serbia.
authors.forename: Karlo T
authors.initials: KT
authors.lastname: Raić
keywords: dislocations; dynamics; metallic material; ultrathin films