title: Ultra-fast preparation of high-performance thermoelectric bulk TiNiSb0.05Sn0.95by microwave synthesis.
abstract: The antimony-doped half-Heusler thermoelectric bulk TiNiSb0.05Sn0.95was prepared via ultra-fast 4.5 min microwave synthesis, cold-press forming and 20 min microwave pressureless sintering. The electrical properties i.e. the Seebeck coefficient (S), electrical resistivity (ρ), and carrier concentration (n) and mobility (μ) were measured on a Seebeck coefficient/resistance analysis system (S/RAs) and Hall effect measurement system (HEMS), respectively. The thermal conductivity (κ) was measured on a laser flash thermal analyzer (LFA). The results show that a high purity single phase was obtained after microwave sintering. The electrical resistivity is 2.70-5.33 μΩ m at temperatures ranging from ∼300 to 773 K. The highest power factor of 4042 μW m-1K-2was achieved at 473 K. The microstructure analyses show that numerous circular intercrystalline pores caused by microwave sintering are present within the TiNiSn grains. The lattice and total thermal conductivity are 1.76-3.77 and 4.66-5.98 W m-1K-1. The highest thermoelectric figure of merit of 0.44 was achieved at 623 K.
authors.affiliation: School of Metallurgy Engineering, Anhui University of Technology, Maxiang Road, Ma'anshan 243032, China. leiyingahut@163.com.
authors.forename: Y
authors.initials: Y
authors.lastname: Li
authors.affiliation: School of Metallurgy Engineering, Anhui University of Technology, Maxiang Road, Ma'anshan 243032, China. leiyingahut@163.com.
authors.forename: C
authors.initials: C
authors.lastname: Cheng
authors.affiliation: School of Metallurgy Engineering, Anhui University of Technology, Maxiang Road, Ma'anshan 243032, China. leiyingahut@163.com and State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan 430074, China.
authors.forename: Y
authors.initials: Y
authors.lastname: Lei
authors.affiliation: School of Metallurgy Engineering, Anhui University of Technology, Maxiang Road, Ma'anshan 243032, China. leiyingahut@163.com.
authors.forename: M
authors.initials: M
authors.lastname: Wang
authors.affiliation: Institute of Materials Science and Engineering, Kunming University of Science and Technology, 727 South Jingming Road, Chenggong New District, Kunming 650093, China.
authors.forename: R D
authors.initials: RD
authors.lastname: Wan