title: Direct stamping of silver nanoparticles toward residue-free thick electrode.
abstract: Direct stamping of functional materials has been developed for cost-effective and process-effective manufacturing of nano/micro patterns. However, there remain several challenging issues like the perfect removal of the residual layer and realization of high aspect ratio. We have demonstrated facile fabrication of flexible strain sensors that have microscale thick interdigitated capacitors with no residual layer by a simple direct stamping with silver nanoparticles (AgNPs). Polyurethane (PU) prepolymer was utilized as an adhesive layer to transfer AgNPs more efficiently during the separation step of the flexible stamp from directly stamped AgNPs. Scanning electron microscopy images and energy dispersive x-ray spectroscopy analysis revealed residue-free transfer of microscale thick interdigitated electrodes onto two different flexible substrates (elastomeric and brittle) for the application to highly sensitive strain sensors.
authors.affiliation: Mechatronic Systems Engineering, School of Engineering Science, Simon Fraser University, Surrey, BC V3T 0A3, Canada.
authors.forename: Jiseok
authors.initials: J
authors.lastname: Kim
authors.affiliation: Mechatronic Systems Engineering, School of Engineering Science, Simon Fraser University, Surrey, BC V3T 0A3, Canada.
authors.forename: Kevin
authors.initials: K
authors.lastname: Wubs
authors.affiliation: Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Daejeon 305-701, Republic of Korea.
authors.forename: Byeong-Soo
authors.initials: BS
authors.lastname: Bae
authors.affiliation: Mechatronic Systems Engineering, School of Engineering Science, Simon Fraser University, Surrey, BC V3T 0A3, Canada.
authors.forename: Woo
authors.initials: W
authors.lastname: Soo Kim
keywords: 10.05; 10.10; direct stamping; flexible sensors; silver nanoparticles; strain sensors