title: In-Plane Deformation Mechanics for Highly Stretchable Electronics.
abstract: Scissoring in thick bars suppresses buckling behavior in serpentine traces that have thicknesses greater than their widths, as detailed in a systematic set of analytical and experimental studies. Scissoring in thick copper traces enables elastic stretchability as large as ≈350%, corresponding to a sixfold improvement over previously reported values for thin geometries (≈60%).
authors.affiliation: State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing, 100190, China.|Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.|School of Engineering Science, University of Chinese Academy of Sciences, Beijing, 100049, China.|State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024, China.
authors.forename: Yewang
authors.initials: Y
authors.lastname: Su
authors.affiliation: School of Mechanical Engineering, Tianjin University of Science & Technology, Tianjin, 300222, China.
authors.forename: Xuecheng
authors.initials: X
authors.lastname: Ping
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Ki Jun
authors.initials: KJ
authors.lastname: Yu
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.|Department of Material Science and Engineering Department of Energy Engineering, Hanyang University, Seoul, 133-791, South Korea.
authors.forename: Jung Woo
authors.initials: JW
authors.lastname: Lee
authors.affiliation: Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.
authors.forename: Jonathan A
authors.initials: JA
authors.lastname: Fan
authors.affiliation: School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater, OK, 74078, USA.
authors.forename: Bo
authors.initials: B
authors.lastname: Wang
authors.affiliation: State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024, China.
authors.forename: Ming
authors.initials: M
authors.lastname: Li
authors.affiliation: State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024, China.
authors.forename: Rui
authors.initials: R
authors.lastname: Li
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Daniel V
authors.initials: DV
authors.lastname: Harburg
authors.affiliation: Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.|State Key Lab Digital Manufacturing Equipment and Technology and Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, China.
authors.forename: YongAn
authors.initials: Y
authors.lastname: Huang
authors.affiliation: Department of Mechanical Engineering, University of Houston, Houston, TX, 77204, USA.
authors.forename: Cunjiang
authors.initials: C
authors.lastname: Yu
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Shimin
authors.initials: S
authors.lastname: Mao
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Jaehoun
authors.initials: J
authors.lastname: Shim
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Qinglin
authors.initials: Q
authors.lastname: Yang
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Pei-Yin
authors.initials: PY
authors.lastname: Lee
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Agne
authors.initials: A
authors.lastname: Armonas
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Ki-Joong
authors.initials: KJ
authors.lastname: Choi
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Yichen
authors.initials: Y
authors.lastname: Yang
authors.affiliation: Department of Material Science and Engineering Department of Energy Engineering, Hanyang University, Seoul, 133-791, South Korea.
authors.forename: Ungyu
authors.initials: U
authors.lastname: Paik
authors.affiliation: Department of Electrical Engineering, Stanford University, Stanford, CA, 94305, USA.
authors.forename: Tammy
authors.initials: T
authors.lastname: Chang
authors.affiliation: Frederick Seitz Materials Research Laboratory, Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Champaign, IL, 61820, USA.
authors.forename: Thomas J
authors.initials: TJ
authors.lastname: Dawidczyk
authors.affiliation: Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.
authors.forename: Yonggang
authors.initials: Y
authors.lastname: Huang
authors.affiliation: School of Mechanical and Aerospace Engineering, Oklahoma State University, Stillwater, OK, 74078, USA.
authors.forename: Shuodao
authors.initials: S
authors.lastname: Wang
authors.affiliation: Department of Electrical and Computer Engineering and the Department of Chemistry Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Champaign, Urbana, IL, 61820, USA.
authors.forename: John A
authors.initials: JA
authors.lastname: Rogers
keywords: buckling mechanics; non-buckling; scissoring; stretchable electronics