title: Ultrahigh Oxidation Resistance and High Electrical Conductivity in Copper-Silver Powder.
abstract: The electrical conductivity of pure Cu powder is typically deteriorated at elevated temperatures due to the oxidation by forming non-conducting oxides on surface, while enhancing oxidation resistance via alloying is often accompanied by a drastic decline of electrical conductivity. Obtaining Cu powder with both a high electrical conductivity and a high oxidation resistance represents one of the key challenges in developing next-generation electrical transferring powder. Here, we fabricate a Cu-Ag powder with a continuous Ag network along grain boundaries of Cu particles and demonstrate that this new structure can inhibit the preferential oxidation in grain boundaries at elevated temperatures. As a result, the Cu-Ag powder displays considerably high electrical conductivity and high oxidation resistance up to approximately 300 °C, which are markedly higher than that of pure Cu powder. This study paves a new pathway for developing novel Cu powders with much enhanced electrical conductivity and oxidation resistance in service.
authors.affiliation: School of Materials Science and Engineering, Central South University, Changsha, China.
authors.forename: Jiaxiang
authors.initials: J
authors.lastname: Li
authors.affiliation: School of Materials Science and Engineering, Central South University, Changsha, China.|State Key Lab for Powder Metallurgy, Central South University, Changsha, China.
authors.forename: Yunping
authors.initials: Y
authors.lastname: Li
authors.affiliation: Advanced Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan.
authors.forename: Zhongchang
authors.initials: Z
authors.lastname: Wang
authors.affiliation: Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Sendai, Miyagi 980-8577, Japan.
authors.forename: Huakang
authors.initials: H
authors.lastname: Bian
authors.affiliation: Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Sendai, Miyagi 980-8577, Japan.
authors.forename: Yuhang
authors.initials: Y
authors.lastname: Hou
authors.affiliation: Institute for Materials Research, Tohoku University, 2-1-1 Katahira, Sendai, Miyagi 980-8577, Japan.
authors.forename: Fenglin
authors.initials: F
authors.lastname: Wang
authors.affiliation: School of Materials Science and Engineering, Central South University, Changsha, China.
authors.forename: Guofu
authors.initials: G
authors.lastname: Xu
authors.affiliation: State Key Lab for Powder Metallurgy, Central South University, Changsha, China.
authors.forename: Bin
authors.initials: B
authors.lastname: Liu
authors.affiliation: State Key Lab for Powder Metallurgy, Central South University, Changsha, China.
authors.forename: Yong
authors.initials: Y
authors.lastname: Liu