title: Rapid formation of Ni3Sn4joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process.
abstract: High melting point Ni3Sn4joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8s. The formed intermetallic joints, which are completely composed of the refined equiaxial Ni3Sn4grains with the average diameter of 2μm, perform the average shear strength of 26.7MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of Ni3Sn4joints.
authors.affiliation: Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China.
authors.forename: Z L
authors.initials: ZL
authors.lastname: Li
authors.affiliation: Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China.
authors.forename: H J
authors.initials: HJ
authors.lastname: Dong
authors.affiliation: Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China. Electronic address: xgsong@hitwh.edu.cn.
authors.forename: X G
authors.initials: XG
authors.lastname: Song
authors.affiliation: Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
authors.forename: H Y
authors.initials: HY
authors.lastname: Zhao
authors.affiliation: Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China.
authors.forename: J C
authors.initials: JC
authors.lastname: Feng
authors.affiliation: Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China.
authors.forename: J H
authors.initials: JH
authors.lastname: Liu
authors.affiliation: Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China.
authors.forename: H
authors.initials: H
authors.lastname: Tian
authors.affiliation: Shandong Provincial Key Lab of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China.
authors.forename: S J
authors.initials: SJ
authors.lastname: Wang
keywords: EBSD; Grain morphology; Ni(3)Sn(4) joints; Orientation relationship; TLP bonding; Ultrasonic soldering