title: Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations.
abstract: In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials for the mold, and the chemical compatibility of the different materials. Our approach was tested on a flexible gastro-stimulator as part of the ENDOGES research program.
authors.affiliation: Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles.
authors.forename: Adrien
authors.initials: A
authors.lastname: Debelle
authors.affiliation: Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles.
authors.forename: Laura
authors.initials: L
authors.lastname: Hermans
authors.affiliation: E.C.A.M., at the Haute Ecole Léonard de Vinci , Brussels, Belgium.
authors.forename: Maxime
authors.initials: M
authors.lastname: Bosquet
authors.affiliation: Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles.
authors.forename: Sam
authors.initials: S
authors.lastname: Dehaeck
authors.affiliation: Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles.
authors.forename: Laurent
authors.initials: L
authors.lastname: Lonys
authors.affiliation: Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles.
authors.forename: Benoit
authors.initials: B
authors.lastname: Scheid
authors.affiliation: Ecole Polytechnique de Bruxelles, at the Université Libre de Bruxelles.
authors.forename: Antoine
authors.initials: A
authors.lastname: Nonclercq
authors.affiliation: Aspire Centre for Rehabilitation Engineering and Assistive Technology at University College London.
authors.forename: Anne
authors.initials: A
authors.lastname: Vanhoestenberghe
keywords: electrical stimulation; flexible electronics; soft encapsulation