title: Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias.
abstract: Three-dimensional integrated circuits (3D ICs) are an attractive replacement for conventional 2D ICs as high-performance, low-power-consumption, and small-footprint microelectronic devices. However, one of the major remaining challenges is the manufacture of high-aspect-ratio through-silicon vias (TSVs), which is a crucial technology for the assembly of 3D Si ICs. Here, we present the fabrication of high-quality TSVs using a femtosecond (fs) 1.5-μm Bessel beam. To eliminate the severe ablation caused by the sidelobes of a conventional Bessel beam, a fs Bessel beam is tailored using a specially designed binary phase plate. We demonstrate that the tailored fs Bessel beam can be used to fabricate a 2D array of approximately ∅10-μm TSVs on a 100-μm-thick Si substrate without any sidelobe damage, suggesting potential application in the 3D assembly of 3D Si ICs.
authors.affiliation: RIKEN Center for Advanced Photonics, Hirosawa 2-1, Wako, Saitama 351-0198, Japan.|State Key Laboratory of High Field Laser Physics, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, P.O. Box 800-211, Shanghai 201800, China.
authors.forename: Fei
authors.initials: F
authors.lastname: He
authors.affiliation: Laboratory of Information Optics and Optoelectronic Technology, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, P.O. Box 800-211, Shanghai 201800, China.
authors.forename: Junjie
authors.initials: J
authors.lastname: Yu
authors.affiliation: State Key Laboratory of High Field Laser Physics, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, P.O. Box 800-211, Shanghai 201800, China.|School of Physical Science and Technology, Shanghai Tech University, Shanghai 200031, China.
authors.forename: Yuanxin
authors.initials: Y
authors.lastname: Tan
authors.affiliation: State Key Laboratory of High Field Laser Physics, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, P.O. Box 800-211, Shanghai 201800, China.
authors.forename: Wei
authors.initials: W
authors.lastname: Chu
authors.affiliation: Laboratory of Information Optics and Optoelectronic Technology, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, P.O. Box 800-211, Shanghai 201800, China.
authors.forename: Changhe
authors.initials: C
authors.lastname: Zhou
authors.affiliation: State Key Laboratory of High Field Laser Physics, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, P.O. Box 800-211, Shanghai 201800, China.
authors.forename: Ya
authors.initials: Y
authors.lastname: Cheng
authors.affiliation: RIKEN Center for Advanced Photonics, Hirosawa 2-1, Wako, Saitama 351-0198, Japan.
authors.forename: Koji
authors.initials: K
authors.lastname: Sugioka