title: A simple and low-cost chip bonding solution for high pressure, high temperature and biological applications.
abstract: The sealing of microfluidic devices remains a complex and time-consuming process requiring specific equipment and protocols: a universal method is thus highly desirable. We propose here the use of a commercially available sealing tape as a robust, versatile, reversible solution, compatible with cell and molecular biology protocols, and requiring only the application of manually achievable pressures. The performance of the seal was tested with regards to the most commonly used chip materials. For most materials, the bonding resisted 5 bars at room temperature and 1 bar at 95 °C. This method should find numerous uses, ranging from fast prototyping in the laboratory to implementation in low technology environments or industrial production.
authors.affiliation: Laboratoire Physico Chimie Curie, Institut Curie, PSL Research University, CNRS UMR168, 75005, Paris, France. iago.pereiro@curie.fr and Sorbonne Universités, UMPC Univ. Paris 06, 75005 Paris, France and Institut Pierre-Gilles de Gennes, 75005, Paris, France.
authors.forename: M
authors.initials: M
authors.lastname: Serra
authors.affiliation: Laboratoire Physico Chimie Curie, Institut Curie, PSL Research University, CNRS UMR168, 75005, Paris, France. iago.pereiro@curie.fr and Sorbonne Universités, UMPC Univ. Paris 06, 75005 Paris, France and Institut Pierre-Gilles de Gennes, 75005, Paris, France.
authors.forename: I
authors.identifier: 0000-0003-3490-5978
authors.initials: I
authors.lastname: Pereiro
authors.affiliation: Laboratoire Physico Chimie Curie, Institut Curie, PSL Research University, CNRS UMR168, 75005, Paris, France. iago.pereiro@curie.fr and Sorbonne Universités, UMPC Univ. Paris 06, 75005 Paris, France and Institut Pierre-Gilles de Gennes, 75005, Paris, France.
authors.forename: A
authors.initials: A
authors.lastname: Yamada
authors.affiliation: Laboratoire Physico Chimie Curie, Institut Curie, PSL Research University, CNRS UMR168, 75005, Paris, France. iago.pereiro@curie.fr and Sorbonne Universités, UMPC Univ. Paris 06, 75005 Paris, France and Institut Pierre-Gilles de Gennes, 75005, Paris, France.
authors.forename: J-L
authors.initials: JL
authors.lastname: Viovy
authors.affiliation: Laboratoire Physico Chimie Curie, Institut Curie, PSL Research University, CNRS UMR168, 75005, Paris, France. iago.pereiro@curie.fr and Sorbonne Universités, UMPC Univ. Paris 06, 75005 Paris, France and Institut Pierre-Gilles de Gennes, 75005, Paris, France.
authors.forename: S
authors.initials: S
authors.lastname: Descroix
authors.affiliation: Laboratoire Physico Chimie Curie, Institut Curie, PSL Research University, CNRS UMR168, 75005, Paris, France. iago.pereiro@curie.fr and Sorbonne Universités, UMPC Univ. Paris 06, 75005 Paris, France and Institut Pierre-Gilles de Gennes, 75005, Paris, France.
authors.forename: D
authors.initials: D
authors.lastname: Ferraro
mesh_terms: D000269:Adhesives; D006358:Hot Temperature; D008422:Materials Testing; D046210:Microfluidic Analytical Techniques / Q000295:instrumentation*; D010969:Plastics; D016133:Polymerase Chain Reaction / Q000295:instrumentation; D011312:Pressure
chemical_list: D000269:Adhesives; D010969:Plastics