High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Material.
Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62-86 W m-1K-1) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam's improved performance (20-30% improved cooling, temperature decrease by ΔT of 44-24 °C).
CNRS-International NTU Thales Research Alliance (CINTRA) UMI 3288 , Research Techno Plaza, 50 Nanyang Drive, Singapore 637553, Singapore.|Institute of Microelectronics, Agency for Science, Technology and Research (A*Star) , 11 Science Park Road, Singapore 117685, Singapore.
Manuela
0000-0001-6211-5821
M
Loeblein
Temasek Laboratories@NTU , 50 Nanyang Avenue, Singapore 639798, Singapore.
Siu Hon
SH
Tsang
CNRS-International NTU Thales Research Alliance (CINTRA) UMI 3288 , Research Techno Plaza, 50 Nanyang Drive, Singapore 637553, Singapore.
Matthieu
M
Pawlik
Temasek Laboratories@NTU , 50 Nanyang Avenue, Singapore 639798, Singapore.
Eric Jian Rong
EJ
Phua
Institute of Microelectronics, Agency for Science, Technology and Research (A*Star) , 11 Science Park Road, Singapore 117685, Singapore.
Han
H
Yong
Institute of Microelectronics, Agency for Science, Technology and Research (A*Star) , 11 Science Park Road, Singapore 117685, Singapore.
Xiao Wu
XW
Zhang
Temasek Laboratories@NTU , 50 Nanyang Avenue, Singapore 639798, Singapore.
Chee Lip
CL
Gan
Edwin Hang Tong
EH
Teo
hot-spot removal; nano−thermal interface material; thermal management; three-dimensional graphene; three-dimensional h-BN