Measuring thermal conductivity of thin films by Scanning Thermal Microscopy combined with thermal spreading resistance analysis.
While measuring the thermal properties of a thin film, one of the most often encountered problems is the influence of the substrate thermal properties on measured signal and the need for its separation. In this work an approach for determining the thermal conductivity κ of a thin layer is presented. It bases on Scanning Thermal Microscopy (SThM) measurement combined with thermal spreading resistance analysis for a system consisting of a single layer on a substrate. Presented approach allows to take into account the influence of the substrate thermal properties on SThM signal and to estimate the true value of a thin film κ. It is based on analytical solution of the problem being a function of dimensionless parameters and requires numerical solution of relatively simple integral equation. As the analysis utilizes a solution in dimensionless parameters it can be used for any substrate-layer system. As an example, the method was applied for determination of the thermal conductivities of 4 different thin layers of thicknesses from 12 to 100nm. The impact of model parameters on the uncertainty of the estimated final κ value was analyzed.
Institute of Physics, Silesian University of Technology, Konarskiego 22B, 44-100 Gliwice, Poland. Electronic address: justyna.juszczyk@polsl.pl.
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Juszczyk
Institute of Physics, Silesian University of Technology, Konarskiego 22B, 44-100 Gliwice, Poland.
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Kaźmierczak-Bałata
Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, Koszykowa 75, 00-662 Warszawa, Poland.
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Firek
Institute of Physics, Silesian University of Technology, Konarskiego 22B, 44-100 Gliwice, Poland.
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Bodzenta
Scanning Thermal Microscopy; Thermal conductivity; Thermal measurement; Thermal probe; Thermal spreading resistance; Thin films