title: [Curing mode of universal adhesives affects the bond strength of resin cements to dentin].
abstract: To determine the effects of curing mode of one-step and two-step universal adhesives on the micro-tensile bond strength (μTBS) of different dual-cure resin cements to dentin.
  
  
  
  One-step universal adhesive Single Bond Universal (SBU), and two-step universal adhesive OptiBond Versa (VSA) were chosen as the subjects, one-step self-etching adhesive OptiBond All in One (AIO) and two-step self-etching adhesive Clearfil SE Bond (SEB) were control groups, and two dual-cure resin cements RelyX Ultimate (RLX) and Nexus 3 Universal (NX3) were used in this study. In this study, 80 extracted human molars were selected and the dentin surface was exposed using diamond saw. The teeth were divided into 16 groups according to the adhesives (AIO, SBU, SEB, VSA), cure modes of adhesives (light cure, non-light cure) and resin cements (RLX, NX3). The adhesives were applied on the dentin surface following the instruction and whether light cured or not, then the resin cements were applied on the adhesives with 1 mm thickness and light cured (650 mW/cm(2) for 20 s. A resin was built up (5 mm) on the cements and light cured layer by layer. After water storage for 24 h, the specimens were cut into resin-cement-dentin strips with a cross sectional area of 1 mm×1 mm and the μTBS was measured.
  
  
  
  Regarding one-step universal adhesive (SBU) light cured, the μTBS with RLX [(35.45±7.04) MPa] or NX3 [(26.84±10.39) MPa] were higher than SBU non-light cured with RLX [(17.93±8.93) MPa)] or NX3 [(10.07±5.89) MPa, P<0.001]. Compared with AIO, light-cured SBU combined with RLX presented higher μTBS than AIO group [(35.45±7.04) MPa vs. (24.86±8.42) MPa, P<0.05]. When SBU was not lighted, the μTBS was lower than AIO [(17.93±8.93) MPa vs. (22.28±7.57) MPa, P<0.05]. For two-step universal adhesive (VSA) and control adhesive (SEB), curing mode did not affect the μTBS when used with either RLX or NX3 (25.98-32.24 MPa, P>0.05).
  
  
  
  Curing mode of one-step universal adhesive may affect the μTBS between dual-cure resin cements and dentin, while for two-step universal adhesive, the curing mode and the type of resin cements did not influence the μTBS.
authors.affiliation: Department of Cariology and Endodontology,Peking University School and Hospital of Stomatology & National Engineering Laboratory for Digital and Material Technology of Stomatology & Beijing Key Laboratory of Digital Stomatology, Beijing 100081, China; Department of Stomatology, Qinhuangdao First Hospital, Qinhuangdao 066000, Hebei, China.
authors.forename: Z R
authors.initials: ZR
authors.lastname: Fu
authors.affiliation: Department of Cariology and Endodontology,Peking University School and Hospital of Stomatology & National Engineering Laboratory for Digital and Material Technology of Stomatology & Beijing Key Laboratory of Digital Stomatology, Beijing 100081, China.
authors.forename: F C
authors.initials: FC
authors.lastname: Tian
authors.affiliation: Department of Cariology and Endodontology,Peking University School and Hospital of Stomatology & National Engineering Laboratory for Digital and Material Technology of Stomatology & Beijing Key Laboratory of Digital Stomatology, Beijing 100081, China.
authors.forename: L
authors.initials: L
authors.lastname: Zhang
authors.affiliation: Department of Cariology and Endodontology,Peking University School and Hospital of Stomatology & National Engineering Laboratory for Digital and Material Technology of Stomatology & Beijing Key Laboratory of Digital Stomatology, Beijing 100081, China.
authors.forename: B
authors.initials: B
authors.lastname: Han
authors.affiliation: Department of Cariology and Endodontology,Peking University School and Hospital of Stomatology & National Engineering Laboratory for Digital and Material Technology of Stomatology & Beijing Key Laboratory of Digital Stomatology, Beijing 100081, China.
authors.forename: X Y
authors.initials: XY
authors.lastname: Wang
mesh_terms: D000269:Adhesives / Q000737:chemistry* / Q000145:classification*; D017438:Bisphenol A-Glycidyl Methacrylate; D003188:Composite Resins / Q000737:chemistry* / Q000145:classification*; D001840:Dental Bonding / Q000379:methods*; D017220:Dentin-Bonding Agents / Q000737:chemistry* / Q000145:classification*; D006801:Humans; D055115:Light-Curing of Dental Adhesives / Q000379:methods; D008422:Materials Testing / Q000379:methods; D008689:Methacrylates; D019279:Resin Cements / Q000737:chemistry* / Q000145:classification*; D055116:Self-Curing of Dental Resins / Q000379:methods; D013718:Tensile Strength / Q000187:drug effects
chemical_list: D000269:Adhesives; C103506:Bis-GMA, BPDM, HEMA dental-bonding resin; C438313:Clearfil SE Bond; D003188:Composite Resins; C095997:DCR cement; D017220:Dentin-Bonding Agents; D008689:Methacrylates; C433206:Nexus; C092987:Optibond; C528569:Rely-X; D019279:Resin Cements; C115612:single bond; D017438:Bisphenol A-Glycidyl Methacrylate