title: A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications.
abstract: Reliability risks for two different types of through-silicon-vias (TSVs) are discussed in this paper. The first is a partially-filled copper TSV, if which the copper layer covers the side walls and bottom. A polymer is used to fill the rest of the cavity. Stresses in risk sites are studied and ranked for this TSV structure by FEA modeling. Parametric studies for material properties (modulus and thermal expansion) of TSV polymer are performed. The second type is a high aspect ratio TSV filled by polycrystalline silicon (poly Si). Potential risks of the voids in the poly Si due to filling defects are studied. Fracture mechanics methods are utilized to evaluate the risk for two different assembly conditions: package assembled to printed circuit board (PCB) and package assembled to flexible substrate. The effect of board/substrate/die thickness and the size and location of the void are discussed.
authors.affiliation: Department of Mechanical Engineering, State University of New York at Binghamton, P.O. Box 6000, Binghamton, NY 13902, USA. sshao1@binghamton.edu.
authors.forename: Shuai
authors.initials: S
authors.lastname: Shao
authors.affiliation: Department of Mechanical Engineering, State University of New York at Binghamton, P.O. Box 6000, Binghamton, NY 13902, USA. dliu5@binghamton.edu.
authors.forename: Dapeng
authors.initials: D
authors.lastname: Liu
authors.affiliation: Department of Mechanical Engineering, State University of New York at Binghamton, P.O. Box 6000, Binghamton, NY 13902, USA. yniu1@binghamton.edu.
authors.forename: Yuling
authors.initials: Y
authors.lastname: Niu
authors.affiliation: Analog Devices, Inc., Wilmington, MA 01887, USA. kathy.odonnell@analog.com.
authors.forename: Kathy
authors.initials: K
authors.lastname: O'Donnell
authors.affiliation: Analog Devices, Inc., Wilmington, MA 01887, USA. dipak.sengupta@analog.com.
authors.forename: Dipak
authors.initials: D
authors.lastname: Sengupta
authors.affiliation: Department of Mechanical Engineering, State University of New York at Binghamton, P.O. Box 6000, Binghamton, NY 13902, USA. sbpark@binghamton.edu.
authors.forename: Seungbae
authors.initials: S
authors.lastname: Park
keywords: MEMS packaging; TSV; finite element analysis (FEA); fracture mechanics; optical sensor; reliability