title: Physics of microstructures enhancement of thin film evaporation heat transfer in microchannels flow boiling.
abstract: Performance enhancement of the two-phase flow boiling heat transfer process in microchannels through implementation of surface micro- and nanostructures has gained substantial interest in recent years. However, the reported results range widely from a decline to improvements in performance depending on the test conditions and fluid properties, without a consensus on the physical mechanisms responsible for the observed behavior. This gap in knowledge stems from a lack of understanding of the physics of surface structures interactions with microscale heat and mass transfer events involved in the microchannel flow boiling process. Here, using a novel measurement technique, the heat and mass transfer process is analyzed within surface structures with unprecedented detail. The local heat flux and dryout time scale are measured as the liquid wicks through surface structures and evaporates. The physics governing heat transfer enhancement on textured surfaces is explained by a deterministic model that involves three key parameters: the drying time scale of the liquid film wicking into the surface structures (τd), the heating length scale of the liquid film (δH) and the area fraction of the evaporating liquid film (Ar). It is shown that the model accurately predicts the optimum spacing between surface structures (i.e. pillars fabricated on the microchannel wall) in boiling of two fluids FC-72 and water with fundamentally different wicking characteristics.
authors.affiliation: Department of Mechanical and Aerospace Engineering, University of Florida, Gainesville, FL 32611, USA.
authors.forename: Sajjad
authors.initials: S
authors.lastname: Bigham
authors.affiliation: Department of Mechanical and Aerospace Engineering, University of Florida, Gainesville, FL 32611, USA.
authors.forename: Abdolreza
authors.initials: A
authors.lastname: Fazeli
authors.affiliation: Department of Mechanical and Aerospace Engineering, University of Florida, Gainesville, FL 32611, USA.
authors.forename: Saeed
authors.initials: S
authors.lastname: Moghaddam