A Novel Polar Copolymer Design as a Multi-Functional Binder for Strong Affinity of Polysulfides in Lithium-Sulfur Batteries.
High energy density, low cost and environmental friendliness are the advantages of lithium-sulfur (Li-S) battery which is regarded as a promising device for electrochemical energy storage systems. As one of the important ingredients in Li-S battery, the binder greatly affects the battery performance. However, the conventional binder has some drawbacks such as poor capability of absorbing hydrophilic lithium polysulfides, resulting in severe capacity decay. In this work, we reported a multi-functional polar binder (AHP) by polymerization of hexamethylene diisocyanate (HDI) with ethylenediamine (EDA) bearing a large amount of amino groups, which were successfully used in electrode preparation with commercial sulfur powder cathodes. The abundant amide groups of the binder endow the cathode with multidimensional chemical bonding interaction with sulfur species within the cathode to inhibit the shuttling effect of polysulfides, while the suitable ductility to buffer volume change. Utilizing these advantageous features, composite C/S cathodes based the binder displayed excellent capacity retention at 0.5 C, 1 C, 1.5 C, and 3 C over 200 cycles. Accompany with commercial binder, AHP may act as an alternative feedstock to open a promising approach for sulfur cathodes in rechargeable lithium battery to achieve commercial application.
School of Applied and Chemical Engineering, Xichang College, Xichang, 615053, China.|State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Yu
Y
Jiao
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Wei
W
Chen
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Tianyu
T
Lei
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China.
Liping
L
Dai
Institute of Microelectronics of Chinese Academy of Sciences, Beijing, 100029, China. b_chen@139.com.
Bo
B
Chen
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China. wucy@zju.edu.cn.
Chunyang
C
Wu
State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, 610054, China. jiexiong@uestc.edu.cn.
Jie
J
Xiong