title: Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN.
abstract: In this work, we report a fabrication of epoxy resin/ordered three-dimensional boron nitride (3D-BN) network composites through combination of ice-templating self-assembly and infiltration methods. The polymer composites possess much higher thermal conductivity up to 4.42 W m-1K-1at relatively low loading 34 vol % than that of random distribution composites (1.81 W m-1K-1for epoxy/random 3D-BN composites, 1.16 W m-1K-1for epoxy/random BN composites) and exhibit a high glass transition temperature (178.9-229.2 °C) and dimensional stability (22.7 ppm/K). We attribute the increased thermal conductivity to the unique oriented 3D-BN thermally conducive network, in which the much higher thermal conductivity along the in-plane direction of BN microplatelets is most useful. This study paves the way for thermally conductive polymer composites used as thermal interface materials for next-generation electronic packaging and 3D integration circuits.
authors.affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China.|Department of Nano Science and Technology Institute, University of Science and Technology of China , Suzhou 215123, China.
authors.forename: Jiantao
authors.identifier: http://orcid.org/0000-0001-9771-0823
authors.initials: J
authors.lastname: Hu
authors.affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China.|Department of Nano Science and Technology Institute, University of Science and Technology of China , Suzhou 215123, China.
authors.forename: Yun
authors.initials: Y
authors.lastname: Huang
authors.affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China.|Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences , Shenzhen 518055, China.
authors.forename: Yimin
authors.initials: Y
authors.lastname: Yao
authors.affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China.|Department of Chemical Engineering, China University of Petroleum , Beijing 102249, China.
authors.forename: Guiran
authors.initials: G
authors.lastname: Pan
authors.affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China.|Department of Nano Science and Technology Institute, University of Science and Technology of China , Suzhou 215123, China.
authors.forename: Jiajia
authors.initials: J
authors.lastname: Sun
authors.affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China.|Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences , Shenzhen 518055, China.
authors.forename: Xiaoliang
authors.initials: X
authors.lastname: Zeng
authors.affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China.
authors.forename: Rong
authors.initials: R
authors.lastname: Sun
authors.affiliation: Department of Electronics Engineering, The Chinese University of Hong Kong , Hong Kong 999077, China.
authors.forename: Jian-Bin
authors.initials: JB
authors.lastname: Xu
authors.affiliation: School of Materials Science and Engineering, Georgia Institute of Technology , Atlanta, Georgia 30332, United States.
authors.forename: Bo
authors.initials: B
authors.lastname: Song
authors.affiliation: Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences , Shenzhen 518055, China.|Department of Electronics Engineering, The Chinese University of Hong Kong , Hong Kong 999077, China.|School of Materials Science and Engineering, Georgia Institute of Technology , Atlanta, Georgia 30332, United States.
authors.forename: Ching-Ping
authors.identifier: http://orcid.org/0000-0003-3556-8053
authors.initials: CP
authors.lastname: Wong
keywords: boron nitride; ordered network; polymer composites; thermal conductivity; thermal interface resistance