title: Nano-inspired smart interfaces: fluidic interactivity and its impact on heat transfer.
abstract: Interface-inspired convection is a key heat transfer scheme for hot spot cooling and thermal energy transfer. An unavoidable trade-off of the convective heat transfer is pressure loss caused by fluidic resistance on an interface. To overcome this limitation, we uncover that nano-inspired interfaces can trigger a peculiar fluidic interactivity, which can pursue all the two sides of the coin: heat transfer and fluidic friction. We demonstrate the validity of a quasi-fin effect of Si-based nanostructures based on conductive capability of heat dissipation valid under the interactivity with fluidic viscous sublayer. The exclusive fluid-interface friction is achieved when the height of the nanostructures is much less than the thickness of the viscous sublayers in the turbulent regime. The strategic nanostructures show an enhancement of heat transfer coefficients in the wall jet region by more than 21% without any significant macroscale pressure loss under single-phase impinging jet. Nanostructures guaranteeing fluid access via an equivalent vacancy larger than the diffusive path length of viscid flow lead to local heat transfer enhancement of more than 13% at a stagnation point. Functional nanostructures will give shape to possible breakthroughs in heat transfer and its optimization can be pursued for engineered systems.
authors.affiliation: IFW Dresden, P. O. Box 270116, 01171 Dresden, Germany.
authors.forename: Beom Seok
authors.initials: BS
authors.lastname: Kim
authors.affiliation: Samsung Electronics Co., Ltd, Digital Appliance Business R&D team, Samsung-ro 129, 16677 Suwon, Korea.
authors.forename: Byoung In
authors.initials: BI
authors.lastname: Lee
authors.affiliation: Department of Mechanical Engineering, Yonsei University, Yonsei-ro 50, 03722 Seoul, Korea.
authors.forename: Namkyu
authors.initials: N
authors.lastname: Lee
authors.affiliation: Department of Mechanical Engineering, Yonsei University, Yonsei-ro 50, 03722 Seoul, Korea.
authors.forename: Geehong
authors.initials: G
authors.lastname: Choi
authors.affiliation: IFW Dresden, P. O. Box 270116, 01171 Dresden, Germany.
authors.forename: Thomas
authors.initials: T
authors.lastname: Gemming
authors.affiliation: Department of Mechanical Engineering, Yonsei University, Yonsei-ro 50, 03722 Seoul, Korea.
authors.forename: Hyung Hee
authors.initials: HH
authors.lastname: Cho